发明公开
EP0257193A2 Low-temperature burnt conductive paste and method of manufacturing printed circuit board
失效
在低温下焙烧的导电膏和制造印刷电路的方法。
- 专利标题： Low-temperature burnt conductive paste and method of manufacturing printed circuit board
- 专利标题（中）： 在低温下焙烧的导电膏和制造印刷电路的方法。
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申请号： EP87106482.0申请日： 1987-05-05
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公开(公告)号： EP0257193A2公开(公告)日： 1988-03-02
- 发明人: Fukuoka, Shingoro , Shintomi, Kouichi , Maeda, Ryu , Shiroyama, Kaisuke
- 申请人： THE FURUKAWA ELECTRIC CO., LTD.
- 申请人地址： 6-1, 2-chome, Marunouchi Chiyoda-ku Tokyo JP
- 专利权人： THE FURUKAWA ELECTRIC CO., LTD.
- 当前专利权人： THE FURUKAWA ELECTRIC CO., LTD.
- 当前专利权人地址： 6-1, 2-chome, Marunouchi Chiyoda-ku Tokyo JP
- 代理机构： Hansen, Bernd, Dr.rer.nat.
- 优先权： JP200731/86 19860827
- 主分类号： H05K3/12
- IPC分类号： H05K3/12 ; H01B1/16 ; H05K1/09
摘要：
Disclosed are a low-temperature burnt conductive paste which is prepared in such a manner that a base material consisting of 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of copper, a copper alloy containing copper as a major component, and oxides thereof and 5 to 50% by weight of a glass powder having a softening point of 300 to 600°C and a coefficient of thermal expansion of 6 to 13 × 10⁻⁶°C⁻¹ is dispersed in an organic vehicle, and a method of manufacturing a printed circuit board using the paste.
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