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    Low-temperature burnt conductive paste and method of manufacturing printed circuit board
    2.
    发明公开
    Low-temperature burnt conductive paste and method of manufacturing printed circuit board 失效
    在低温下焙烧的导电膏和制造印刷电路的方法。

    公开(公告)号：EP0257193A2

    公开(公告)日：1988-03-02

    申请号：EP87106482.0

    申请日：1987-05-05

    申请人： THE FURUKAWA ELECTRIC CO., LTD.

    发明人： Fukuoka, Shingoro ,  Shintomi, Kouichi ,  Maeda, Ryu ,  Shiroyama, Kaisuke

    IPC分类号： H05K3/12 ,  H01B1/16 ,  H05K1/09

    CPC分类号： H05K1/092 ,  H01B1/16

    摘要： Disclosed are a low-temperature burnt conductive paste which is prepared in such a manner that a base material consisting of 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of copper, a copper alloy containing copper as a major component, and oxides thereof and 5 to 50% by weight of a glass powder having a softening point of 300 to 600°C and a coefficient of thermal expansion of 6 to 13 × 10⁻⁶°C⁻¹ is dispersed in an or­ganic vehicle, and a method of manufacturing a printed circuit board using the paste.

    摘要翻译： 本发明公开了低温燃烧导电性糊剂的所有其在寻求的方式制备做了基底材料由50％至95％（重量）由铜组成的组中选择的至少一种导电材料的粉末，铜合金含有铜的 作为主要成分，以及它们的氧化物和5至50％（重量）具有300的软化点为600℃和6至13×10的热膨胀系数的玻璃粉末的< - > <6>℃下< - > <1>在有机载体分散在，以及使用该糊制造印刷电路板的方法。

    Joined parts of Ni-Ti alloys with different metals and joining method therefor
    6.
    发明公开
    Joined parts of Ni-Ti alloys with different metals and joining method therefor 失效
    Verbundene Teile von Ni-Ti-Legierugen mit verschiedenen Metallen und Verbindungsverfahrendafür。

    公开(公告)号：EP0508414A1

    公开(公告)日：1992-10-14

    申请号：EP92106086.9

    申请日：1992-04-08

    申请人： THE FURUKAWA ELECTRIC CO., LTD. ,  MASUNAGA MENLO PARK CO., LTD.

    发明人： Nakamura, Masayuki ,  Shiroyama, Kaisuke ,  Masunaga, Satoru ,  Murata, Kazuo

    IPC分类号： B23K11/20 ,  B23K20/22

    CPC分类号： B23K11/20 ,  B23K20/22 ,  B23K20/227 ,  B23K20/233 ,  Y10S420/902 ,  Y10T428/12806 ,  Y10T428/12944

    摘要： A joined parts of Ni-Ti alloys with different metals having a joined interfacial parts of Ni-Ti alloys with different metals other than said alloy, comprising a melt forged structure obtained through the reactive fusion due to the fusion of at least one metal bordering on said joined interface and the application of pressure, and a hot forged structure of Ni-Ti alloys obtained by softening said alloy at high temperature and applying pressure on the side of Ni-Ti alloys and a hot forged structure of said different metals obtained by softening said metal at high temperature and applying pressure on the side of different metals across said melt forged structure, and a direct joining method for obtaining this joined parts are disclosed.
    It is possible to join Ni-Ti alloys component with different metals component providing high strength without deteriorating the characteristics.

    摘要翻译： 具有不同金属的Ni-Ti合金的接合部分具有Ni-Ti合金与除所述合金以外的不同金属的界面部分的接合部分，其包括通过至少一种接合的金属的熔融而通过反应性熔合获得的熔体锻造结构 所述接合界面和压力的应用，以及通过在高温下软化所述合金并在Ni-Ti合金侧施加压力而获得的Ni-Ti合金的热锻造结构以及通过软化获得的所述不同金属的热锻造结构 所述金属在高温下施加压力并在所述熔体锻造结构的不同金属侧施加压力，并且公开了用于获得该接合部件的直接接合方法。 可以将Ni-Ti合金组分与不同金属组分接合而提供高强度而不劣化特性。

    Method of manufacturing a superconductor
    10.
    发明公开
    Method of manufacturing a superconductor 失效
    Verfahren zur Herstellung eines Supraleiters。

    公开(公告)号：EP0305820A2

    公开(公告)日：1989-03-08

    申请号：EP88113435.7

    申请日：1988-08-18

    申请人： THE FURUKAWA ELECTRIC CO., LTD.

    发明人： Shiga, Shoji ,  Uno, Naoki ,  Tanaka, Yasuzo ,  Kikuchi, Hiroyuki ,  Shiroyama, Kaisuke

    IPC分类号： H01L39/24 ,  H01L39/14 ,  H01B12/04

    CPC分类号： H01L39/248 ,  C04B35/45 ,  C04B35/62254 ,  Y10T29/49014

    摘要： A method of manufacturing a superconductor (12) includes the steps of filling a ceramic superconductor (2) or a material mixture thereof in a metal container (1), elongating the metal container (1), slitting the metal container (1) by a predetermined width to par­tially expose a material (2) inside the metal container (1), and sintering the material (2) inside the metal container (1).

    摘要翻译： 制造超导体（12）的方法包括以下步骤：在金属容器（1）中填充陶瓷超导体（2）或其材料混合物，延伸金属容器（1），将金属容器（1）切割成 预定宽度以部分地暴露金属容器（1）内部的材料（2），并且烧结金属容器（1）内部的材料（2）。