Disclosed are a low-temperature burnt conductive paste which is prepared in such a manner that a base material consisting of 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of copper, a copper alloy containing copper as a major component, and oxides thereof and 5 to 50% by weight of a glass powder having a softening point of 300 to 600°C and a coefficient of thermal expansion of 6 to 13 × 10⁻⁶°C⁻¹ is dispersed in an or­ganic vehicle, and a method of manufacturing a printed circuit board using the paste.