A photocurable resin composition comprising: (a) a modified resin prepared by the reaction of either a conjugate diene polymer having a number-average molecular weight of 500 to 5,000 and a vinyl content of at least 50 mole % or an adduct prepared from the diene polymer and an α,β-unsaturated dicarboxylic acid anhydride and having a softening of 70 to 200 °C as measured by the ring and ball softening point method of JIS K 2531-60 with an α,β-unsaturated monocarboxylic ester having an alcoholic hydroxyl group represented by general formula (I) to thereby effect the ring opening of at least 10 mole % of the acid anhydride groups of the adduct, wherein R1 and R2 each represents a hydrogen atom or a methyl group and R3 represents a residue of a C2 or higher hydrocarbon which may contain a heteroatom, (b) a wax having a melting point of 100 °C or below as determined by the dropping method of ASTM D 127, and (c) a photopolymerization initiator.