PHOTOCURABLE RESIN COMPOSITION
    3.
    发明公开
    PHOTOCURABLE RESIN COMPOSITION 失效
    可光固化树脂组合物

    公开(公告)号:EP0465669A4

    公开(公告)日:1992-06-03

    申请号:EP91902795

    申请日:1991-01-29

    摘要: A photocurable resin composition comprising: (a) a modified resin prepared by the reaction of either a conjugate diene polymer having a number-average molecular weight of 500 to 5,000 and a vinyl content of at least 50 mole % or an adduct prepared from the diene polymer and an α,β-unsaturated dicarboxylic acid anhydride and having a softening of 70 to 200 °C as measured by the ring and ball softening point method of JIS K 2531-60 with an α,β-unsaturated monocarboxylic ester having an alcoholic hydroxyl group represented by general formula (I) to thereby effect the ring opening of at least 10 mole % of the acid anhydride groups of the adduct, wherein R1 and R2 each represents a hydrogen atom or a methyl group and R3 represents a residue of a C2 or higher hydrocarbon which may contain a heteroatom, (b) an inorganic or organic powder having a mean particle diameter of 5 νm or less, or a grafted inorganic powder prepared by grafting an (un)saturated and (un)substituted hydrocarbon residue onto an inorganic powder having a particle size of 0.1 νm or less, wherein the total number of carbon atoms of the hydrocarbon residues grafted onto one inorganic atom is 4 or above, and (c) a photopolymerization initiator.

    摘要翻译: 一种光固化树脂组合物,它包含:(a)通过数均分子量为500-5,000和乙烯基含量至少为50%摩尔的共轭二烯聚合物或由二烯制备的加合物反应制备的改性树脂 聚合物和α,β-不饱和二羧酸酐组成,并且通过JIS K2531-60的环球法软化点法测定的软化度为70-200℃的具有醇羟基的α,β-不饱和单羧酸酯 (I)表示的基团,由此实现加合物的酸酐基团的至少10摩尔%的开环,其中R1和R2各自表示氢原子或甲基,并且R3表示C2的残基 (b)平均粒径为5μm或更小的无机或有机粉末,或通过将(未)饱和和(未)取代的烃再接枝制备的接枝无机粉末 (c)光聚合引发剂,所述无机粉末的粒径为0.1μm或更小,其中接枝到一个无机原子上的烃残基的总碳原子数为4或更多。