发明公开
EP0510969A3 Semiconductor circuit device wiring and semiconductor circuit device
失效
半导体电路器件接线和半导体电路器件
- 专利标题： Semiconductor circuit device wiring and semiconductor circuit device
- 专利标题（中）： 半导体电路器件接线和半导体电路器件
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申请号： EP92303655.2申请日： 1992-04-23
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公开(公告)号： EP0510969A3公开(公告)日： 1993-03-03
- 发明人: Tsubouchi, Kazuo , Ohmi, Tadahiro , Hiura, Yohei , Masu, Kazuya
- 申请人： Tsubouchi, Kazuo
- 申请人地址： 30-38 Hitokita 2-chome, Taihaku-ku Sendai-shi, Miyagi-ken JP
- 专利权人： Tsubouchi, Kazuo
- 当前专利权人： Tsubouchi, Kazuo
- 当前专利权人地址： 30-38 Hitokita 2-chome, Taihaku-ku Sendai-shi, Miyagi-ken JP
- 代理机构： Beresford, Keith Denis Lewis
- 优先权： JP95558/91 19910425
- 主分类号： H01L23/532
- IPC分类号： H01L23/532
摘要：
A semiconductor circuit device wiring is provided in which the wiring connected to a semiconductor element is composed of a crystalline material. The crystal axis direction along which nearest neighboring atoms in a single crystal constituting the crystalline material are arranged and the electric current direction through the wiring are crossed with each other at an angle of 22.5° or less.
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