公开(公告)号：EP0510969A3

公开(公告)日：1993-03-03

申请号：EP92303655.2

申请日：1992-04-23

申请人： Tsubouchi, Kazuo

发明人： Tsubouchi, Kazuo ,  Ohmi, Tadahiro ,  Hiura, Yohei ,  Masu, Kazuya

IPC分类号： H01L23/532

CPC分类号： H01L23/53214 ,  H01L23/53228 ,  H01L23/53257 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor circuit device wiring is provided in which the wiring connected to a semiconductor element is composed of a crystalline material. The crystal axis direction along which nearest neighboring atoms in a single crystal constituting the crystalline material are arranged and the electric current direction through the wiring are crossed with each other at an angle of 22.5° or less.

公开(公告)号：EP0510969A2

公开(公告)日：1992-10-28

申请号：EP92303655.2

申请日：1992-04-23

申请人： Tsubouchi, Kazuo

发明人： Tsubouchi, Kazuo ,  Ohmi, Tadahiro ,  Hiura, Yohei ,  Masu, Kazuya

IPC分类号： H01L23/532

CPC分类号： H01L23/53214 ,  H01L23/53228 ,  H01L23/53257 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor circuit device wiring is provided in which the wiring connected to a semiconductor element is composed of a crystalline material. The crystal axis direction along which nearest neighboring atoms in a single crystal constituting the crystalline material are arranged and the electric current direction through the wiring are crossed with each other at an angle of 22.5° or less.

摘要翻译： 提供一种半导体电路器件布线，其中连接到半导体元件的布线由结晶材料构成。 布置构成结晶材料的单晶中最靠近的原子的晶轴方向，通过布线的电流方向以22.5°以下的角度相互交叉。