发明公开
- 专利标题： Thin film tape head assembly
- 专利标题（中）： Dünnfilm-Bandkopfanordnung。
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申请号： EP92104671.0申请日： 1992-03-18
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公开(公告)号： EP0515786A1公开(公告)日： 1992-12-02
- 发明人: Bischoff, Peter G. , Gooden, Carroll S. , Leung, Chak M.
- 申请人： READ-RITE CORPORATION
- 申请人地址： 345 Los Coches Street Milpitas California 95035 US
- 专利权人： READ-RITE CORPORATION
- 当前专利权人： READ-RITE CORPORATION
- 当前专利权人地址： 345 Los Coches Street Milpitas California 95035 US
- 代理机构： Körber, Wolfhart, Dr.rer.nat.
- 优先权： US705754 19910528
- 主分类号： G11B5/31
- IPC分类号： G11B5/31 ; G11B5/105
摘要：
A tape head assembly is formed by depositing a multiplicity of thin film transducers (12) on a ceramic wafer or substrate. The wafer is divided into head bars (16), each of which has one or more thin film transducers (12) on its face. End sections (20A, 20B) and a cover bar (18) are joined to the head bar (16) to form a head bar subassembly. A flexible cable (26) or electrical pins are provided between the end sections to enable electrical connection between the head circuit and external circuitry. By joining a number of head bar subassemblies, a multigap thin film tape head assembly is produced to serve as a read/write device.
公开/授权文献
- EP0515786B1 Thin film tape head assembly 公开/授权日：1997-06-11
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