A process for use in manufacturing opto-electronic components in opto-electronic hybrid module form. V-grooves (42) are provided by anisotropic etching techniques in a silicon substrate (41). Electrical ground planes (43) and interconnects (46, 49) are provided on dielectric layers (44, 50) with interconnections between them by way of vias (45, 51). Solder wettable pads (52) are provided on the outermost dielectric layer (50). Solder bumps (54) for use in a flip-chip bonding technique are provided by a wet forward technique. Components such as a laser array (30) are bonded to the solder bumps in accurate alignment therewith.