发明公开
- 专利标题： Cooling device
- 专利标题（中）： Kühlungseinrichtung。
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申请号： EP93119629.9申请日： 1993-12-06
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公开(公告)号： EP0601516A1公开(公告)日： 1994-06-15
- 发明人: Sato, Kazuo , Shikida, Mitsuhiro , Ohashi, Shigeo , Hatada, Toshio , Ashiwake, Noriyuki , Tanaka, Shinji , Harada, Takeshi , Honda, Yukio
- 申请人： HITACHI, LTD.
- 申请人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 专利权人： HITACHI, LTD.
- 当前专利权人： HITACHI, LTD.
- 当前专利权人地址： 6, Kanda Surugadai 4-chome Chiyoda-ku, Tokyo 101 JP
- 代理机构： Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr
- 优先权： JP326422/92 19921207; JP27763/93 19930217
- 主分类号： H01L23/467
- IPC分类号： H01L23/467 ; F04B43/04 ; H02N1/00
摘要：
A cooling device (1) according to the present invention, in which a space (37) is formed by means of flat electrodes (31, 32) and side plates (5, 6) disposed on the ends of the flat electrodes (31, 32), and a flexible film (4) fastened in that space (37) in a shape of the letter S, is fixed to a semiconductor package (2) so that one of the flat electrodes (31, 32) is fitted on the semiconductor package (2). The respective flat electrodes (31, 32) are alternately powered to move the S shaped section of the flexible film (4).
公开/授权文献
- EP0601516B1 Cooling device 公开/授权日：1998-10-07
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