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11 条记录 (耗时 0.012 秒)

    Ice thermal storage type air-conditioner and ice thermal storage tank
    1.
    发明公开
    Ice thermal storage type air-conditioner and ice thermal storage tank 有权
    冰蓄热式空调和冰蓄热水箱

    公开(公告)号：EP0942239A3

    公开(公告)日：2002-06-05

    申请号：EP99103125.3

    申请日：1999-02-17

    申请人： Hitachi, Ltd.

    发明人： Imanari, Masao ,  Fukushima, Toshihiko ,  Hatada, Toshio ,  Matsubara, Katsumi ,  Katsumata, Naoto

    IPC分类号： F24F5/00

    CPC分类号： F24F5/0017 ,  F28D20/021 ,  Y02E60/145 ,  Y02E60/147

    摘要： An ice thermal storage type air-conditioner and an ice thermal storage tank, in which unused portions in the ice thermal storage tank is reduced to enhance an ice filling rate in the ice thermal storage tank or to prevent excessive icing from damaging a heat transfer unit. An ice thermal storage type air-conditioner in which heat exchangers are installed in the ice thermal storage tank 1, the heat exchangers having a heightwise size extending from a bottom of the ice thermal storage tank 1 to near a top of a container, and comprising a plurality of flat-shaped plate-type heat transfer units 14 arranged therein in layered manner in a thicknesswise direction

    摘要翻译： 一种冰蓄热式空调和冰蓄热箱，其中冰蓄热箱中的未使用部分被减小以增加冰蓄热箱中的冰充满率或防止过度结冰损坏热传递单元 。 一种冰蓄热式空调器，其中换热器安装在冰蓄热箱1中，换热器的高度尺寸从冰蓄热箱1的底部延伸到容器的顶部附近，并且包括： 多个扁平形板状传热单元14在厚度方向上以分层方式布置在其中

    Cooling system of electronic computer
    4.
    发明公开
    Cooling system of electronic computer 失效
    Elektronisches-电脑Kühlsystem。

    公开(公告)号：EP0489326A2

    公开(公告)日：1992-06-10

    申请号：EP91120034.3

    申请日：1991-11-25

    申请人： HITACHI, LTD.

    发明人： Ohashi, Shigeo ,  Nakajima, Tadakatsu ,  Kuwahara, Heikichi ,  Hatada, Toshio ,  Matsushima, Hitoshi ,  Sato, Motohiro ,  Inouye, Hiroshi ,  Ohba, Takao ,  Yamagiwa, Akira

    IPC分类号： G06F1/20 ,  H05K7/20

    CPC分类号： H05K7/208 ,  F28D15/0233 ,  F28D15/0275 ,  G06F1/20 ,  G06F1/206 ,  G06F2200/201 ,  H05K7/20809

    摘要： An electronic computer cooling system having a cooling apparatus to cool an electronic computer and cooling members (4, 41) for thermally connecting semiconductor devices (1) whose operating speeds are raised by cooling to a low temperature source of the cooling apparatus. Circuit boards (2) onto which the semiconductor devices (1) and the like constructing the electronic computer are mounted and the cooling apparatus such as a refrigerating apparatus and the like are compactly enclosed in a single casing (5). Or, the circuit boards (2) and the cooling apparatus are compactly enclosed in separate detachable casings, respectively. Thus, a structure in which desired semiconductor devices can be certainly cooled by using the cooling members (4, 41) is obtained.

    摘要翻译： 一种电子计算机冷却系统，具有用于冷却电子计算机的冷却装置和用于将通过冷却升高其运行速度的半导体装置（1）冷却到冷却装置的低温源的冷却构件（41,41）。 安装构成电子计算机的半导体装置（1）等的电路板（2），冷却装置等冷却装置紧密地封闭在单个壳体（5）中。 或者，电路板（2）和冷却装置分别紧密地封闭在分离的可拆卸的壳体中。 因此，可以获得通过使用冷却部件（41,41）可靠地冷却期望的半导体器件的结构。

    Cooling device
    5.
    发明公开
    Cooling device 失效
    Kühlungseinrichtung。

    公开(公告)号：EP0601516A1

    公开(公告)日：1994-06-15

    申请号：EP93119629.9

    申请日：1993-12-06

    申请人： HITACHI, LTD.

    发明人： Sato, Kazuo ,  Shikida, Mitsuhiro ,  Ohashi, Shigeo ,  Hatada, Toshio ,  Ashiwake, Noriyuki ,  Tanaka, Shinji ,  Harada, Takeshi ,  Honda, Yukio

    IPC分类号： H01L23/467 ,  F04B43/04 ,  H02N1/00

    CPC分类号： H01L23/467 ,  F04B43/043 ,  F04B45/047 ,  H01L2924/0002 ,  H01L2924/15192 ,  H02K99/20 ,  H02N1/006 ,  H01L2924/00

    摘要： A cooling device (1) according to the present invention, in which a space (37) is formed by means of flat electrodes (31, 32) and side plates (5, 6) disposed on the ends of the flat electrodes (31, 32), and a flexible film (4) fastened in that space (37) in a shape of the letter S, is fixed to a semiconductor package (2) so that one of the flat electrodes (31, 32) is fitted on the semiconductor package (2). The respective flat electrodes (31, 32) are alternately powered to move the S shaped section of the flexible film (4).

    摘要翻译： 根据本发明的冷却装置（1），其中通过平面电极（31,32）和设置在扁平电极（31,32）的端部上的侧板（5,6）形成空间（37） 32），并且固定在该字形S的形状的空间（37）中的柔性膜（4）固定到半导体封装（2），使得一个平板电极（31,32）安装在 半导体封装（2）。 各个扁平电极（31,32）交替供电以移动柔性膜（4）的S形部分。

    Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon
    6.
    发明公开
    Jet cooling apparatus for cooling electronic equipment and computer having the same mounted thereon 失效
    用于与该装置的电子和计算机组件喷嘴冷却装置。

    公开(公告)号：EP0563755A1

    公开(公告)日：1993-10-06

    申请号：EP93104755.9

    申请日：1993-03-23

    申请人： HITACHI, LTD.

    发明人： Matsushima, Hitoshi ,  Komatu, Toshihiro ,  Kondou, Yoshihiro ,  Hatada, Toshio ,  Iwai, Susumu ,  Honma, Tetsuro ,  Iino, Toshiki ,  Ohba, Takao ,  Yamagiwa, Akira

    IPC分类号： H05K7/00 ,  H05K7/20

    CPC分类号： H05K7/20727

    摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particular on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals, the cooling apparatus having a fan fastened to one wall surface of a chamber and a plurality of jet cooling means formed on the surface opposing the wall surface, the jet cooling means being formed in parallel to the printed circuit boards. The jet cooling means are slits, or nozzle or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

    摘要翻译： 用于通过使均匀地安装在电子设备上热产生装置的温度分布，在计算机上更特别是提高了设备​​的可靠性和减少在执行维护的时所需的工作过程用于电子设备的冷却装置 通过堆叠，在一帧中的印刷电路板在电子设备中，电子印刷电路板在其上热产生装置，颜色：诸如CPU和存储器，被安装在规定的间隔，具有风扇的冷却装置紧固到一个壁表面 一腔室和喷射的冷却装置形成的表面相对的壁面上的多个，喷射冷却装置形成在平行于印刷电路板。 射流冷却装置的狭缝，或者喷嘴或喷流管道中的印刷电路板之间延伸并且被形成为在喷射流状态供给冷却空气到各热产生装置。 因此，冷却空气能集中到局部冷却的印刷电路板，其包括该装置没有产生大热值的热耗率。 因此，在热发生器件的温度上升变得均匀。