发明授权
- 专利标题： Adhesives for electroless plating and printed circuit boards
- 专利标题（中）： 粘合剂的无电解电镀和印刷电路板
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申请号： EP94107717.4申请日： 1994-05-18
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公开(公告)号： EP0625537B1公开(公告)日： 2000-12-27
- 发明人: Wang, Dong Dong, c/o Ibiden Co., Ltd. , Asai, Motoo, c/o Ibiden Co., Ltd.
- 申请人： IBIDEN CO, LTD.
- 申请人地址： 1, Kanda-cho 2-chome Ogaki-shi Gifu 503 JP
- 专利权人： IBIDEN CO, LTD.
- 当前专利权人： IBIDEN CO, LTD.
- 当前专利权人地址： 1, Kanda-cho 2-chome Ogaki-shi Gifu 503 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP11690393 19930519
- 主分类号： C08J3/00
- IPC分类号： C08J3/00 ; C09J101/00 ; C09J163/00 ; C09J171/00 ; C09J181/06
摘要：
An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
公开/授权文献
- EP0625537A1 Adhesives for electroless plating and printed circuit boards 公开/授权日：1994-11-23
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