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1.发明公开Adhesives for electroless plating and printed circuit boards 失效KlebstoffefürStromlose Metallisierung und Leiterplatten。
公开(公告)号：EP0625537A1
公开(公告)日：1994-11-23
申请号：EP94107717.4
申请日：1994-05-18
申请人： IBIDEN CO, LTD.
IPC分类号： C08J3/00 , C09J101/00 , C09J163/00 , C09J171/00 , C09J181/06
CPC分类号： H05K3/4661 , C08J3/005 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K3/0023 , H05K3/181 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , C08L2666/02 , C08L2666/22
摘要： An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
摘要翻译： 通过将可溶于酸或氧化剂的固化的耐热树脂粉末分散在难溶于酸或氧化剂的未固化的耐热树脂基体中，形成印刷电路板形成中的无电镀的粘合剂。 其中耐热树脂基质是热塑性树脂和未固化的热固性树脂或未固化的感光树脂的混合物的固化处理。
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公开(公告)号：EP0625537B1
公开(公告)日：2000-12-27
申请号：EP94107717.4
申请日：1994-05-18
申请人： IBIDEN CO, LTD.
IPC分类号： C08J3/00 , C09J101/00 , C09J163/00 , C09J171/00 , C09J181/06
CPC分类号： H05K3/4661 , C08J3/005 , C08L63/00 , C08L63/10 , C08L71/00 , C09J171/00 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K3/0023 , H05K3/181 , H05K2201/0129 , H05K2201/0212 , H05K2203/0773 , H05K2203/0789 , H05K2203/0796 , C08L2666/02 , C08L2666/22
摘要： An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
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