摘要:
An adhesive usable for electroless plating in the formation of printed circuit boards is formed by dispersing a cured heat-resistant resin powder soluble in an acid or an oxidizing agent into an uncured heat-resistant resin matrix hardly soluble in an acid or an oxidizing agent after the curing treatment, in which the heat-resistant resin matrix is a mixture of a thermoplastic resin and an uncured thermosetting resin or an uncured photosensitive resin.
摘要:
[Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same. [Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200°C or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190°C or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 µm and less than 10.0 µm.
摘要:
Adhesive composition comprising: --a component A) comprising a solution of a chlorosulfonated polymer or of another elastomer in admixture with a sulfonyl chloride in one or more polymerizable vinyl monomers and an oxaziridine having the formula: wherein R₁, R₂, and R₃, which may be the same or different, may be a hydrogen atom, an alkyl, isoalkyl, cycloalkyl or aromatic radical having a number of carbon atoms ranging from 1 to 20; --a component B) containing an organic or inorganic reducing agent.
摘要:
Adhesive composition comprising: --a component A) comprising a solution of a chlorosulfonated polymer or of another elastomer in admixture with a sulfonyl chloride in one or more polymerizable vinyl monomers and an oxaziridine having the formula: wherein R₁, R₂, and R₃, which may be the same or different, may be a hydrogen atom, an alkyl, isoalkyl, cycloalkyl or aromatic radical having a number of carbon atoms ranging from 1 to 20; --a component B) containing an organic or inorganic reducing agent.
摘要:
Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
摘要:
Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
摘要:
Reworkable adhesive that has a high shear strength through a range of use temperatures but which has a low strength and is reworkable at a suitable processing.
摘要:
The invention relates to a method for increasing the toughness of a material achieved by means of curing a composition including at least one vinyl ester monomer. Said method includes incorporating a sulfonated polyaromatic thermoplastic polymer into said composition, carried out by dissolving the vinyl ester monomer and the thermoplastic polymer in a reactive diluent in which both are soluble. The invention also relates to a curable compound including at least one vinyl ester monomer and enabling the production of materials having a very high toughness, as well as to a material obtained by curing said composition. The invention can be used in the aeronautical, space, railroad, naval, automobile, and arms industries, etc.