发明授权
- 专利标题： PROCEDE DE FABRICATION D'UN DISPOSITIF A SEMI-CONDUCTEURS COMPORTANT AU MOINS UNE PUCE, ET DISPOSITIF CORRESPONDANT
- 专利标题（英）： Process for the manufacture of a solid-state device including at least one chip, and corresponding device
- 专利标题（中）： 方法的半导体元件与至少一个芯片和相应的组件。
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申请号： EP93913073.8申请日： 1993-05-26
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公开(公告)号： EP0642699B1公开(公告)日： 2007-11-07
- 发明人: VAL, Christian , VAN CAMPENHOUT, Yves , GILET, Dominique
- 申请人： Tronic's Microsystems , ELA MEDICAL
- 申请人地址： 15, rue des Martyrs 38054 Grenoble FR
- 专利权人： Tronic's Microsystems,ELA MEDICAL
- 当前专利权人： Tronic's Microsystems,ELA MEDICAL
- 当前专利权人地址： 15, rue des Martyrs 38054 Grenoble FR
- 代理机构： Benoit, Monique
- 优先权： FR9206518 19920527
- 国际公布： WO1993024956 19931209
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L21/60 ; H01L23/49 ; H01L23/522
摘要：
The solid-state device includes at least one chip on a support. The chip (12) is coated with an electrically insulating and heat stable material (13). Through the electrically insulating and heat stable material (13) pass electrical connection leads (16) which connect the chip sites (15) to metallic contact pads (14), the leads (16) being substantially perpendicular both to said sites (15) and said metallic contact pads (14).
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