摘要:
The invention relates to a process for collective manufacturing of cavities and/or membranes (24), with a given thickness d, in a wafer said to be a semiconductor on insulator layer, comprising at least one semiconducting surface layer with a thickness d on an insulating layer, this insulating layer itself being supported on a substrate, this process comprising: - etching of the semiconducting surface layer with thickness d, the insulating layer forming a stop layer, to form said cavities and/or membranes in the surface layer.
摘要:
The invention relates to an electromechanical device comprising: a stack consisting of an insulating layer (31) inserted between two solid layers (10, 30); a micromechanical structure (60) suspended above a recess (4); and a nanometric structure (7) suspended above the recess (4); the relevant position of the nanometric structure (7) relative to the micrometric structure (60) being defined by the delimitation of the contours of the two structures (7, 60) by etching a first surface of a substrate consisting of a solid layer (10) so as to obtain trenches (16) which define the structures (7, 60).
摘要:
A device comprises a support structure (40) with a support area (40.1). A group of at least one getter material elements (41.1, ..., 41.40) is provided on said support area (40.1) within a group perimeter. Said group of getter material elements (41.1, ..., 41.40) provides a total exposure surface for absorbing gas molecules from a space above said support structure (40). The total exposure surface has a three-dimensional shape that is such that a ratio between the exposure surface area and a flat area delimited by the group perimeter is at least 120%.
摘要:
Séquenceur pour dispositif sécurisé de mise à feu formant un microsystème électromécanique, comprenant : - un canal (1) de transmission ; - une barrière (2) apte à se déplacer en translation entre une position de repos obturant totalement le canal (1) et une position de libération totale du canal ; et - un organe mobile (3) coopérant avec la barrière (2) et apte à se déplacer, sous l'action d'un signal de validation, entre une position de verrouillage initiale interdisant le déplacement de la barrière (2) jusqu'à la position de libération totale et une position de déverrouillage autorisant le déplacement de la barrière (2) jusqu'à sa position de libération totale. Le séquenceur comprend en outre : - un premier ensemble (A, A') de moyens mécaniques apte à empêcher le déplacement de l'organe mobile (3) jusqu'à sa position de déverrouillage lorsque le déplacement de la barrière (2) est initié avant celui de l'organe mobile (3), et ce tant que le déplacement de la barrière (2) de la position de repos à la position de libération totale est inférieur à un seuil de déplacement ; et - un deuxième ensemble (B, B') de moyens mécaniques apte à empêcher le déplacement de l'organe mobile (3) vers sa position de déverrouillage lorsque l'organe mobile (3) est actionné préalablement au déplacement de la barrière (2) vers la position de libération.
摘要:
An inertial sensor including at least one measurement beam and one active body formed of a proof body and of deformable plates, said active body being maintained in suspension inside of a tight enclosure via its plates, the measurement beam connecting a portion of the proof body to an internal wall of said enclosure, said measurement beam having a lower thickness than the proof body.
摘要:
The invention relates to a device for measuring pressure through the capacitive effect between two electrodes, including at least one sensitive electrode (11) spaced apart from and opposite a stationary electrode (211) so as to define a cavity (4) in which a reference pressure (Pref) exists. The device according to the invention further includes a protective housing (1) for insulating at least the stationary electrode from the ambient environment in which the pressure (P) to be measured exists, said housing (1) having at least one solid portion, forming a recess (10) for containing at least the stationary electrode (211), and a thinned portion forming the sensitive electrode (11).
摘要:
The invention relates to an electromechanical microstructure (1) consisting of a first mechanical part (102) which is made from a first conductive material and which comprises (i) an elastically-deformable area (104) having a given thickness value and an exposed surface (2) and (ii) a first organic film (4) having a given thickness, which is disposed over the entire exposed surface (2) of the aforementioned deformable area (104). The invention is characterised in that (a) the thickness of the first film (4) is such that the elastic response of the deformable area (104) comprising the first film (4) does not change by more than 5 % in relation to the response of the bare deformable area (104) or (b) in that the thickness of the first film (4) is ten times smaller than the thickness of the deformable area (104). The invention is suitable for the production of electromechanical microstructures.
摘要:
The invention relates to an electromechanical device characterised in that it comprises a stack made up of an insulating layer (31) inserted between two solid layers (10, 30), and a micromechanical structure (60, 61) with predetermined thickness suspended above a recess (4) with predetermined depth, the recess (4) and the micromechanical structure (60, 61) making up one of the two solid layers (10, 30) of the stack, and the insulating layer (31) making up the bottom of said recess (4).