发明公开
- 专利标题： Electronic device package
- 专利标题（中）： Gehäusefürelektronische Bauelemente。
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申请号： EP94308914.4申请日： 1994-12-01
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公开(公告)号： EP0660383A1公开(公告)日： 1995-06-28
- 发明人: Degani, Yinon , Dudderar, Thomas Dixon , Han, Byung Joon , Raju, Venkataram Reddy
- 申请人： AT&T Corp.
- 申请人地址： 32 Avenue of the Americas New York, NY 10013-2412 US
- 专利权人： AT&T Corp.
- 当前专利权人： AT&T Corp.
- 当前专利权人地址： 32 Avenue of the Americas New York, NY 10013-2412 US
- 代理机构： Johnston, Kenneth Graham
- 优先权： US168543 19931216; US260859 19940616
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L23/31 ; H01L23/24
摘要：
An electronic device (300), such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board (200) with which it is thermal expansion mismatched by means of three or more localized rigid support elements (243,253; 244,254; 245,255). The bottom surface of the chip is bonded to the top surface of preferably only one of these support elements (244,254) and can laterally slide along the top surfaces of the others in response to heating and cooling during electrical operations of the electronic device. In addition, the electronic device is encapsulated in a soft gel (400) that is held in place by means of a rigid plastic half-shell cover (500) that is epoxy-bonded in place along its perimeter (edge).
公开/授权文献
- EP0660383B1 Electronic device package 公开/授权日：2003-07-23
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