公开(公告)号：EP0660383B1

公开(公告)日：2003-07-23

申请号：EP94308914.4

申请日：1994-12-01

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Han, Byung Joon ,  Raju, Venkataram Reddy

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/24

CPC分类号： H01L24/83 ,  H01L23/04 ,  H01L23/24 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP0660383A1

公开(公告)日：1995-06-28

申请号：EP94308914.4

申请日：1994-12-01

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Han, Byung Joon ,  Raju, Venkataram Reddy

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/24

CPC分类号： H01L24/83 ,  H01L23/04 ,  H01L23/24 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device (300), such as an integrated circuit chip or a multichip module, is held in place overlying a circuit board (200) with which it is thermal expansion mismatched by means of three or more localized rigid support elements (243,253; 244,254; 245,255). The bottom surface of the chip is bonded to the top surface of preferably only one of these support elements (244,254) and can laterally slide along the top surfaces of the others in response to heating and cooling during electrical operations of the electronic device. In addition, the electronic device is encapsulated in a soft gel (400) that is held in place by means of a rigid plastic half-shell cover (500) that is epoxy-bonded in place along its perimeter (edge).

摘要翻译： 诸如集成电路芯片或多芯片模块的电子设备（300）被保持在覆盖电路板（200）的适当位置，借助于这三个或更多个局部刚性支撑元件（243,253; 244,254）热膨胀失配 ; 245,255）。 芯片的底表面优选地仅与这些支撑元件（244,254）中的一个结合，并且可以响应于电子设备的电气操作期间的加热和冷却而沿着其它顶表面侧向滑动。 此外，电子器件被封装在软凝胶（400）中，软凝胶（400）通过刚性塑料半壳盖（500）保持就位，该刚性塑料半壳罩（500）沿其周边（边缘）环氧粘合就位。