公开(公告)号：EP0541282B1

公开(公告)日：1997-01-15

申请号：EP92309779.4

申请日：1992-10-26

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Kossives, Dean Paul

IPC分类号： H05K3/34 ,  B23K35/36

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  B23K2201/40 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3489 ,  H01L2924/00

公开(公告)号：EP0729183A2

公开(公告)日：1996-08-28

申请号：EP96301024.4

申请日：1996-02-14

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Han, Byung J. ,  Dudderar, Thomas D. ,  Lyons, Alan M. ,  Tai, King L.

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/14

CPC分类号： H01L25/162 ,  H01L23/13 ,  H01L23/147 ,  H01L23/24 ,  H01L23/3677 ,  H01L23/5385 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/141 ,  H05K1/142 ,  H05K1/182 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A novel packaging of semiconductor elements, such as MCM tiles, with a variety of printed circuit or wired boards (PWB), the packages occupying a small size, at least in the vertical direction, relative to prior art OMPAC devices. The MCM tile includes an interconnection substrate with peripheral metallizations and at least one chip or integrated circuit (IC) mounted on the substrate by solder reflow or conductive adhesive technology. The PWB which may be a single level or a multilevel, is provided with an aperture for accommodation of at least one chip therein. Depending on the type of interconnection between the substrate and the PWB, the aperture may be larger than the substrate of the MCM tile for wire bonding interconnection or smaller than the substrate for solder reflow or conductive adhesive interconnection. In the wire bonding case, the MCM tile is positioned within the aperture resting on the surface of the PWB or of a structural member or of a heat sink which encloses one end of the aperture. The other end of the aperture may be open or enclosed by a structural member, a heat sink, another PWB or a mother board. For solder reflow or conductive adhesive interconnection, the substrate which is larger than the aperture is positioned so that its ends overlap areas of the PWB adjacent the aperture and the chips and/or substrate are positioned within the aperture. The interconnections are enclosed in a compliable encapsulating material, such as silica gel.

摘要翻译： 相对于现有技术的OMPAC设备，至少在垂直方向上具有小尺寸的半导体元件（例如MCM瓦片）与各种印刷电路板或布线板（PWB）的新型封装。 MCM瓦片包括具有外围金属化的互连基板和通过焊料回流或导电粘合技术安装在基板上的至少一个芯片或集成电路（IC）。 可以是单级或多级的PWB设置有用于容纳至少一个芯片的孔。 根据基板和PWB之间的互连类型，孔径可以大于用于引线接合互连的MCM瓦片的基板，或者小于用于焊料回流或导电粘合剂互连的基板。 在引线接合壳体中，MCM瓦片位于留在PWB或包围孔的一端的结构构件或散热器的表面上的孔内。 孔的另一端可以由结构构件，散热器，另一PWB或母板打开或封闭。 对于焊料回流或导电粘合剂互连，大于孔的衬底被定位成使得其端部与邻近孔的重叠区域重叠，并且芯片和/或衬底位于孔内。 互连被封装在可复制的封装材料中，例如硅胶。

公开(公告)号：EP0721122A1

公开(公告)日：1996-07-10

申请号：EP95308513.1

申请日：1995-11-28

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Presby, Herman Melvin

IPC分类号： G02B6/30 ,  G02B6/38

CPC分类号： G02B6/30 ,  G02B6/3885 ,  G02B6/4249

摘要： A method of connecting arrays of optical wavepaths is described employing externally located connector pads (1-4,50). After optically aligning the arrays (51,52) to be connected, the connector pads are bonded (58) to the arrays and then to each other. In the preferred embodiments, the pads, which typically are thin silicon wafers, and the arrays are metalized and then soldered together. The use of connector pads to connect arrays of optical transmission paths results in sturdy, stable connections. The technique is fast, simple and inexpensive, and is consistent with current alignment procedures. By using solder to secure the pads to the arrays and to each other, connections can be undone and then redone. Inasmuch as all connections are external to the optical paths, there is no deterioration of the optical connections with time.

摘要翻译： 连接光学波径的阵列的制造方法进行说明用人位于外部的连接器焊盘（1至4.50）。 光学对准所述阵列（51,52）被连接后，连接器焊盘接合（58）连接到阵列，然后海誓山盟。 在优选的实施例中，垫，其通常是薄的硅晶片，并且阵列是金属化的，然后焊接在一起。 使用的连接器焊盘到的光传输路径的结果阵列连接在坚固的，稳定的连接。 该技术是快速，简单和廉价的，并且是与当前的调整步骤是一致的。 通过使用焊料与焊盘固定到所述阵列和海誓山盟，连接可以被撤消，然后重做。 因为所有的连接都是外部的光路，没有随时间的光学连接的劣化。

公开(公告)号：EP0597635A1

公开(公告)日：1994-05-18

申请号：EP93308841.1

申请日：1993-11-04

申请人： AT&T Corp.

发明人： Degani, Yinon

IPC分类号： B23K35/363 ,  B23K35/36

CPC分类号： B23K35/3612 ,  B23K35/36

摘要： A solder paste that is useful in applications such as surface mounting of components on printed circuit boards has been found. After soldering, the residue requires no cleaning. The achievement of these desirable properties is accomplished by employing a solder flux vehicle including a three component residue modifier. Said vehicle comprises an acid, a viscosity modifies, a solvent composition, and a mixture comprising A) a rosin or a dimerized rosin, B) castor oil, and C) pentaerythritol tetrabenzoate or bis(2-ethylhexyl)sebacute.

摘要翻译： 已经发现可用于诸如印刷电路板上部件表面安装的应用中的焊膏。 焊接后，残留物不需要清洁。 通过使用包含三组分残留改性剂的焊剂载体来实现这些所需性能的实现。 所述载体包含酸，粘度改变，溶剂组合物和包含A）松香或二聚松香，B）蓖麻油和C）季戊四醇四苯甲酸酯或双（2-乙基己基）酯的混合物。

公开(公告)号：EP0266939B1

公开(公告)日：1994-04-06

申请号：EP87309291.0

申请日：1987-10-21

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Heller, Adam

IPC分类号： C09D17/00 ,  C09C1/36 ,  D21H19/38 ,  C09D7/12 ,  C08K3/22

CPC分类号： C09C1/3653 ,  C01P2004/51 ,  C01P2004/62 ,  C01P2004/82 ,  C01P2006/12 ,  C01P2006/60 ,  C08K3/22 ,  C09C1/3623 ,  C09D7/61 ,  C09D7/68

摘要： Paints and coatings involving titanium dioxide pigments generally degrade because of oxidation of the binder by reactants that are photochemically produced on the pigment surface, and because of direct oxidation by charges that are photogenerated in the pigment. This interaction is substantially reduced by avoiding reduced species and by introducing into the titanium dioxide trap states where photogenerated electron-hole pairs recombine such traps can be introduced by processes such as prolonged milling. Through these expedients, a substantial increase in the stability of the composition is obtained.

公开(公告)号：EP0586243A1

公开(公告)日：1994-03-09

申请号：EP93306917.1

申请日：1993-09-01

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Tai, King Lien

IPC分类号： H01L21/60 ,  H01L21/48

CPC分类号： H01L24/81 ,  H01L21/4867 ,  H01L24/75 ,  H01L2224/1132 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/1216 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10674 ,  H05K2203/048 ,  H01L2924/00

摘要： A multichip module is assembled using flip-chip bonding technology, a stencil printable solder paste and standard surface mount equipment for interconnecting signaling input/output contact pads on devices within such multichip module. The disclosed assembly process makes the heretofore difficult and expensive flip chip bonding technique achievable at low cost. The flip chip bonding technique is simplified by use of a solder paste which includes desirable reflow alignment, fluxing and printability characteristics. These desirable characteristics allow the assembly process to be further economically achieved by permitting the use of standard surface mount equipment in the process. High volume production of standard inexpensive modules are thus possible through this process while also achieving the advantage of high density interconnections afforded through the flip-chip bonding technology.

摘要翻译： 多芯片模块使用倒装芯片焊接技术组装，模版印刷焊膏和标准表面贴装设备，用于在这种多芯片模块内的设备上互连信号输入/输出接触焊盘。 所公开的组装过程使得迄今为止难以实现并且昂贵的倒装芯片接合技术以低成本实现。 通过使用包括期望的回流对准，助熔和可印刷性特征的焊膏来简化倒装芯片接合技术。 这些期望的特征允许通过允许在该过程中使用标准表面贴装设备来进一步经济地实现组装过程。 因此，可以通过该方法大量生产标准廉价的模块，同时还实现了通过倒装芯片接合技术提供的高密度互连的优点。

公开(公告)号：EP0541282A3

公开(公告)日：1994-02-23

申请号：EP92309779.4

申请日：1992-10-26

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Kossives, Dean Paul

IPC分类号： H05K3/34 ,  B23K35/36

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  B23K2201/40 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3489 ,  H01L2924/00

摘要： Soldering is performed and the residues associated with the soldering process are removed through the use of a specific process. Components such as two integrated circuits or an integrated circuit and mounting board are initially tacked by compression bonding or through the use of adhesives. Flux is introduced, and the components to be soldered are brought to reflow temperature. The flux is chosen so that upon reflow and subsequent cool - ing to a temperature of 100°C, or lower, the flux remains in liquid state. The flux is then easily re - moved by cleaning with a miscible liquid that is subsequently removed through processes such as spinning and evaporation.

摘要翻译： 执行焊接并通过使用特定工艺去除与焊接工艺相关的残留物。 诸如两个集成电路或集成电路和安装板的组件最初通过压缩结合或通过使用粘合剂来定位。 引入助焊剂，并将要焊接的组件置于回流温度。 助焊剂的选择应使回流和后续冷却至100°C或更低的温度时，助焊剂保持液态。 然后通过用可混溶的液体进行清洁，然后通过诸如旋转和蒸发等工艺将其除去，从而使焊剂易于再次移动。

公开(公告)号：EP0508678A2

公开(公告)日：1992-10-14

申请号：EP92302886.4

申请日：1992-04-02

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Kimball, Robert M. ,  Shevchuk, George John

IPC分类号： G02B6/38

CPC分类号： G02B6/3838 ,  G02B6/3869 ,  G02B6/3873 ,  G02B6/389

摘要： An optical fiber connector pair is provided, which includes a plug assembly 10 and a receptacle 20. An optical connection can be repeatedly made and broken by insertion and withdrawal, repectively, of the plug assembly relative to the receptacle. The final alignment of the mating fiber ends is provided by a pair of silicon blocks 190, 370, each having a guiding groove formed in one surface. One block is included in the receptacle, and the other block is included in the plug assembly. One fiber end is affixed in each groove. The act of inserting the plug assembly in the receptacle brings the grooved surfaces together such that each fiber is captured by the opposing groove.

摘要翻译： 提供了一种光纤连接器对，其包括插头组件10和插座20.光学连接可以通过插头组件相对于插座的相应插入和抽出来重复地制成和断开。 配对光纤端部的最终对准由一对硅块190,370提供，每个硅块具有形成在一个表面中的引导槽。 插座中包含一个块，另一个块包含在插头组件中。 一个纤维端固定在每个凹槽中。 将插头组件插入插座中的动作使沟槽表面在一起，使得每个光纤被相对的沟槽捕获。

公开(公告)号：EP0660383B1

公开(公告)日：2003-07-23

申请号：EP94308914.4

申请日：1994-12-01

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Dudderar, Thomas Dixon ,  Han, Byung Joon ,  Raju, Venkataram Reddy

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/24

CPC分类号： H01L24/83 ,  H01L23/04 ,  H01L23/24 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP0700239A1

公开(公告)日：1996-03-06

申请号：EP95305910.2

申请日：1995-08-23

申请人： AT&T Corp.

发明人： Degani, Yinon ,  Law, Henry Hon ,  Jin, Sungho ,  McCormack, Mark Thomas

IPC分类号： H05K3/34 ,  H05K1/09 ,  H01L23/495 ,  B23K35/00 ,  B23K35/26

CPC分类号： H05K3/244 ,  B23K35/001 ,  B23K35/262 ,  H01L2924/0002 ,  H05K3/3463 ,  H05K2203/0723 ,  H01L2924/00

摘要： The present invention relates to solderable surfaces and surface finishes which comprise zinc. An electrical article is provided comprising a non-conductive substrate for supporting electric device elements. At least one electrical device element is disposed on the non-conductive substrate. At least one metallized region is formed on the non-conductive substrate, the metallized region electrically communicating with the electrical device element. The metallized region comprises a layer which includes zinc. Typically, the zinc is provided in the form of a zinc-containing alloy. In a further embodiment, the present invention provides electrical components having an electrical connection element which includes a zinc-containing surface.

摘要翻译： 本发明涉及包含锌的可焊接表面和表面光洁度。 提供一种电气制品，其包括用于支撑电气装置元件的非导电基底。 至少一个电气元件元件设置在非导电基底上。 在非导电衬底上形成至少一个金属化区域，金属化区域与电气元件元件电连通。 金属化区域包括包含锌的层。 通常，锌以含锌合金的形式提供。 在另一实施例中，本发明提供了具有包括含锌表面的电连接元件的电气部件。