A method for fabricating stacks of IC chips (20) into modules providing high density electronics. A relatively large number of layers (26) are stacked, and then integrated by curing adhesive (44) applied between adjacent layers (26). A large stack (20) is formed, various processing steps are performed on the access plane face (24) of the large stack (20), and then the large stack (20) is segmented to form a plurality of smaller, or short, stacks (22). Means (134) are provided for causing separation of the larger stack (20) into smaller stacks (22), without disturbing the adhesive (44) which binds the layers (26) within each small stack (22).