公开(公告)号：EP0676087A1

公开(公告)日：1995-10-11

申请号：EP94909418.0

申请日：1993-12-16

申请人： IRVINE SENSORS CORPORATION

发明人： MINIHAN, Joseph, A. ,  PEPE, Angel, A.

IPC分类号： H01L27 ,  H01L21

CPC分类号： H01L21/67121 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for fabricating stacks of IC chips (20) into modules providing high density electronics. A relatively large number of layers (26) are stacked, and then integrated by curing adhesive (44) applied between adjacent layers (26). A large stack (20) is formed, various processing steps are performed on the access plane face (24) of the large stack (20), and then the large stack (20) is segmented to form a plurality of smaller, or short, stacks (22). Means (134) are provided for causing separation of the larger stack (20) into smaller stacks (22), without disturbing the adhesive (44) which binds the layers (26) within each small stack (22).

公开(公告)号：EP0676087B1

公开(公告)日：2003-11-12

申请号：EP94909418.9

申请日：1993-12-16

申请人： IRVINE SENSORS CORPORATION

发明人： MINIHAN, Joseph, A. ,  PEPE, Angel, A.

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L25/065 ,  H01L21/98

CPC分类号： H01L21/67121 ,  H01L25/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for fabricating stacks of IC chips (20) into modules providing high density electronics. A relatively large number of layers (26) are stacked, and then integrated by curing adhesive (44) applied between adjacent layers (26). A large stack (20) is formed, various processing steps are performed on the access plane face (24) of the large stack (20), and then the large stack (20) is segmented to form a plurality of smaller, or short, stacks (22). Means (134) are provided for causing separation of the larger stack (20) into smaller stacks (22), without disturbing the adhesive (44) which binds the layers (26) within each small stack (22).

公开(公告)号：EP0663140A1

公开(公告)日：1995-07-19

申请号：EP93922760.0

申请日：1993-09-27

申请人： IRVINE SENSORS CORPORATION

发明人： PEPE, Angel, A. ,  REINKER, David, M. ,  MINAHAN, Joseph, A.

IPC分类号： H05K3 ,  H01L21

CPC分类号： H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L27/14634 ,  H01L27/1465 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16237 ,  H01L2224/75 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00

摘要： A method and product are disclosed in which multiple solder bumps (76) on a first planar surface (66) are guided into engagement with terminals (76) on a second planar surface (72) by means of holes (80) formed (by a photolithographic process) in a dielectric layer (78), which has been added to the second surface (72) to provide the holes (80) (or sockets) through which the solder bumps (76) (or plugs) extend. The perforated (hole-providing) layer may be formed of one of several materials. The preferred perforated layer material is a photo-definable polyamide, which is hardened by heating after the holes have been formed. Small solder bumps (84) may be formed inside the holes (80) on the second surface (72), in order to facilitate bonding between the solder bumps (76) on the first surface (66) and the terminals (70) on the second surface (72).

摘要翻译： 公开了一种方法和产品，其中第一平面表面（66）上的多个焊料凸块（76）通过形成的孔（80）被引导成与第二平面表面（72）上的端子（76）接合 （或光刻工艺）在已被添加到第二表面（72）以提供焊料凸块（76）（或插塞）延伸穿过的孔（80）（或插座）的介电层（78）中。 穿孔（提供孔）层可以由几种材料中的一种形成。 优选的穿孔层材料是可光定义的聚酰胺，其在孔形成后通过加热而硬化。 可以在第二表面（72）上的孔（80）内部形成小的焊料凸块（84），以便促进第一表面（66）上的焊料凸块（76）与第一表面 第二表面（72）。