发明公开
EP0677878A2 Double-epitaxy heterojunction bipolar transistors for high speed performance
失效
Doppelepitaxie-heterojunction-BipolartransistorfürHochgeschwindigkeitsanwendungen。
- 专利标题: Double-epitaxy heterojunction bipolar transistors for high speed performance
- 专利标题(中): Doppelepitaxie-heterojunction-BipolartransistorfürHochgeschwindigkeitsanwendungen。
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申请号: EP95101502.3申请日: 1995-02-03
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公开(公告)号: EP0677878A2公开(公告)日: 1995-10-18
- 发明人: Tran, Liem Thanh , Streit, Dwight Christopher , Oki, Aaron Kenji
- 申请人: TRW INC.
- 申请人地址: One Space Park, Bldg. E1/4021 Redondo Beach, California 90278 US
- 专利权人: TRW INC.
- 当前专利权人: TRW INC.
- 当前专利权人地址: One Space Park, Bldg. E1/4021 Redondo Beach, California 90278 US
- 代理机构: Schmidt, Steffen J., Dipl.-Ing.
- 优先权: US227148 19940413
- 主分类号: H01L29/737
- IPC分类号: H01L29/737 ; H01L21/203 ; H01L21/331
摘要:
This invention discloses a heterojunction bipolar transistor (HBT) which includes a relatively thin intrinsic collector region and a relatively thick extrinsic collector region such that collector-base capacitance is reduced and electron transit time is maintained. The fabrication of the HBT includes loading a semi-insulating substrate into an molecular beam epitaxy machine, and growing a sub-collector contact layer, a bottom collector layer and a top collector layer on the substrate. Next, the substrate is removed from the molecular beam epitaxy machine and the top collector layer is etched by a photolithographic process to produce separate intrinsic and extrinsic collector regions. Then, the substrate is again loaded into the molecular beam epitaxy machine so that the base and emitter layers can be grown. And finally, the emitter layer is etched to form an emitter mesa only over the intrinsic semiconductor region.
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