发明公开
EP0677878A2 Double-epitaxy heterojunction bipolar transistors for high speed performance 失效
Doppelepitaxie-heterojunction-BipolartransistorfürHochgeschwindigkeitsanwendungen。

  • 专利标题: Double-epitaxy heterojunction bipolar transistors for high speed performance
  • 专利标题(中): Doppelepitaxie-heterojunction-BipolartransistorfürHochgeschwindigkeitsanwendungen。
  • 申请号: EP95101502.3
    申请日: 1995-02-03
  • 公开(公告)号: EP0677878A2
    公开(公告)日: 1995-10-18
  • 发明人: Tran, Liem ThanhStreit, Dwight ChristopherOki, Aaron Kenji
  • 申请人: TRW INC.
  • 申请人地址: One Space Park, Bldg. E1/4021 Redondo Beach, California 90278 US
  • 专利权人: TRW INC.
  • 当前专利权人: TRW INC.
  • 当前专利权人地址: One Space Park, Bldg. E1/4021 Redondo Beach, California 90278 US
  • 代理机构: Schmidt, Steffen J., Dipl.-Ing.
  • 优先权: US227148 19940413
  • 主分类号: H01L29/737
  • IPC分类号: H01L29/737 H01L21/203 H01L21/331
Double-epitaxy heterojunction bipolar transistors for high speed performance
摘要:
This invention discloses a heterojunction bipolar transistor (HBT) which includes a relatively thin intrinsic collector region and a relatively thick extrinsic collector region such that collector-base capacitance is reduced and electron transit time is maintained. The fabrication of the HBT includes loading a semi-insulating substrate into an molecular beam epitaxy machine, and growing a sub-collector contact layer, a bottom collector layer and a top collector layer on the substrate. Next, the substrate is removed from the molecular beam epitaxy machine and the top collector layer is etched by a photolithographic process to produce separate intrinsic and extrinsic collector regions. Then, the substrate is again loaded into the molecular beam epitaxy machine so that the base and emitter layers can be grown. And finally, the emitter layer is etched to form an emitter mesa only over the intrinsic semiconductor region.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/68 ..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的(H01L29/96优先)
H01L29/70 ...双极器件
H01L29/72 ....晶体管型器件,如连续响应于所施加的控制信号的
H01L29/73 .....双极结型晶体管
H01L29/737 ......异质结晶体管
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