发明公开
EP0746022A1 Hybrid multi-chip module and method of fabricating
失效
混合 - 多芯片和Verfahren zur seiner Herstellung
- 专利标题： Hybrid multi-chip module and method of fabricating
- 专利标题（中）： 混合 - 多芯片和Verfahren zur seiner Herstellung
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申请号： EP96108455.5申请日： 1996-05-28
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公开(公告)号： EP0746022A1公开(公告)日： 1996-12-04
- 发明人: Scanlan, Christopher M. , Raleigh, Carl J.
- 申请人： MOTOROLA, INC.
- 申请人地址： 1303 East Algonquin Road Schaumburg, IL 60196 US
- 专利权人： MOTOROLA, INC.
- 当前专利权人： MOTOROLA, INC.
- 当前专利权人地址： 1303 East Algonquin Road Schaumburg, IL 60196 US
- 代理机构： Hudson, Peter David
- 优先权： US452753 19950530
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L21/48 ; H01L23/15
摘要：
A hybrid multi-chip module includes semiconductor chips (27,31) bonded to a base plate (24). The base plate includes a substrate (11) having two surfaces (12,13) and a conductive material (32) molded on the two surfaces (12,13). A coefficient of thermal expansion (CTE) mismatch between the substrate (11) and the conductive material (32) at the first surface (12) is balanced by a similar, but opposite, CTE mismatch between the substrate (11) and the conductive material (32) at the second surface (13). The CTE mismatch balance across the base plate (24) produces a base plate (24) having a substantially planar form at high temperatures.
公开/授权文献
- EP0746022B1 Hybrid multi-chip module and method of fabricating 公开/授权日：1999-08-11
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