A probing apparatus has an apparatus body (1) and a test head (4) detachable from the apparatus body. A probe card having a plurality of probe needles to be brought into contact with a semiconductor wafer (W) is supported by the test head. Three engaging rods (15) are disposed on the test head around the probe card to receive the load of the test head in a distributed manner. A vertically movable work table (5) is disposed on the apparatus body to place a substrate thereon. Two first support mechanisms (11) and one second support mechanism (12) are disposed on the apparatus body around the work table to support the test head such that the probe card opposes the work table. The support mechanisms detachably engage with the engaging rods and support the test head through the engaging rods. The first support mechanisms have elevating mechanisms (20) for moving the test head in the vertical direction through the engaging rods. When the test head is moved by the elevating mechanisms, the inclination of the probe card with respect to the wafer placed on the work table is adjusted.