公开(公告)号：EP4432330A1

公开(公告)日：2024-09-18

申请号：EP22895437.6

申请日：2022-11-02

申请人： Tokyo Electron Limited

发明人： HAYAKAWA, Susumu ,  MIZOMOTO, Yasutaka

IPC分类号： H01L21/02 ,  H01L21/60 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673

CPC分类号： H01L21/60 ,  H01L21/677 ,  H01L21/67 ,  H01L21/673 ,  H01L21/02

摘要： A processing system configured to process multiple chips includes a chip placing apparatus configured to pick the chip up and dispose on an attraction surface of a first electrostatic carrier. The chip placing apparatus includes a placement carrier holder configured to hold the first electrostatic carrier; and a power supply configured to apply a voltage to the first electrostatic carrier held by the placement carrier holder.

公开(公告)号：EP3929603B1

公开(公告)日：2024-07-10

申请号：EP21181712.7

申请日：2021-06-25

IPC分类号： G01R31/28

CPC分类号： G01R31/2865 ,  G01R31/2874

公开(公告)号：EP3905307B1

公开(公告)日：2024-06-19

申请号：EP21169517.6

申请日：2021-04-20

IPC分类号： H01L21/311 ,  H01J37/32

CPC分类号： H01L21/31116 ,  H01J37/32724

公开(公告)号：EP4368749A1

公开(公告)日：2024-05-15

申请号：EP22837607.5

申请日：2022-06-30

申请人： Tokyo Electron Limited

发明人： NAKANE, Yuta ,  KUMAKURA, Sho

IPC分类号： C23F1/12 ,  H01L21/3065

CPC分类号： H01L21/3065 ,  C23F1/12

摘要： In one exemplary embodiment, a substrate processing method includes: (a) providing a substrate including a metal-containing film and a mask provided on the metal-containing film; (b) forming a protective film on the mask; and (c) etching the metal-containing film after (b). (c) includes (c1) forming a second metal-containing substance from a first metal-containing substance contained in the metal-containing film by using a first processing gas including a fluorine-containing gas, and (c2) removing the second metal-containing substance by using a second processing gas including a precursor.

公开(公告)号：EP3940403B1

公开(公告)日：2024-05-08

申请号：EP21186060.6

申请日：2021-07-16

IPC分类号： G01R31/28

CPC分类号： G01R31/2891 ,  G01R31/2875

公开(公告)号：EP3614419B1

公开(公告)日：2024-05-01

申请号：EP17906757.4

申请日：2017-12-20

IPC分类号： C23C16/32 ,  C23C16/44 ,  C23C16/458 ,  H01L21/02

CPC分类号： H01L21/02529 ,  H01L21/0262 ,  C23C16/325 ,  C23C16/4405 ,  C23C16/4404 ,  C23C16/4583

公开(公告)号：EP3308170B1

公开(公告)日：2023-08-23

申请号：EP16812316.4

申请日：2016-06-15

发明人： BORES, Gregory ,  GOMI, Hisashi ,  OZAKI, Shigenori ,  TAMURA, Akitake ,  FUJI, Toshimitsu ,  TAKEUCHI, Haruki

IPC分类号： C12M1/00 ,  C12M3/00 ,  C12M1/12

公开(公告)号：EP3550313B1

公开(公告)日：2023-07-26

申请号：EP17876248.0

申请日：2017-09-29

发明人： KASAI, Shigeru ,  FUJISAWA, Yoshinori

IPC分类号： G01R31/26 ,  H01L21/66 ,  H01L21/683 ,  G01R31/28 ,  H01L21/67

公开(公告)号：EP3366779B1

公开(公告)日：2023-06-07

申请号：EP16857119.8

申请日：2016-03-16

发明人： SUZUKI, Takashi ,  HIRAMARU, Daisuke ,  TAKAHASHI, Masatoshi ,  TOMITA, Kentaro ,  HATABAYASHI, Kunitada ,  KAGAWA, Kenichi ,  OZAKI, Shigenori

IPC分类号： C12Q1/02 ,  C12N5/071 ,  C12N5/0735 ,  C12N5/10 ,  C12N5/074

公开(公告)号：EP3282475B1

公开(公告)日：2021-09-08

申请号：EP16776316.8

申请日：2016-02-10

发明人： OBIKANE Tadashi ,  SHIBATA Hidekazu

IPC分类号： H01L21/683