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    Testing apparatus
    2.
    发明公开
    Testing apparatus 失效
    检测仪器

    公开(公告)号：EP0752588A2

    公开(公告)日：1997-01-08

    申请号：EP96110892.5

    申请日：1996-07-05

    申请人： TOKYO ELECTRON LIMITED

    发明人： Obikane, Tadashi ,  Hayashi, Eiji ,  Koshi, Ryoichiro

    IPC分类号： G01R1/067 ,  G01R31/316

    CPC分类号： G01R1/06705 ,  G01R31/2886

    摘要： A probing apparatus has an apparatus body (1) and a test head (4) detachable from the apparatus body. A probe card having a plurality of probe needles to be brought into contact with a semiconductor wafer (W) is supported by the test head. Three engaging rods (15) are disposed on the test head around the probe card to receive the load of the test head in a distributed manner. A vertically movable work table (5) is disposed on the apparatus body to place a substrate thereon. Two first support mechanisms (11) and one second support mechanism (12) are disposed on the apparatus body around the work table to support the test head such that the probe card opposes the work table. The support mechanisms detachably engage with the engaging rods and support the test head through the engaging rods. The first support mechanisms have elevating mechanisms (20) for moving the test head in the vertical direction through the engaging rods. When the test head is moved by the elevating mechanisms, the inclination of the probe card with respect to the wafer placed on the work table is adjusted.

    摘要翻译： 探测装置具有装置主体（1）和可从装置主体拆卸的测试头（4）。 具有多个要与半导体晶片（W）接触的探针针的探针卡由测试头支撑。 三个接合杆（15）设置在探针卡周围的测试头上以分布式接收测试头的负载。 在设备主体上设置可垂直移动的工作台（5）以在其上放置基板。 两个第一支撑机构（11）和一个第二支撑机构（12）围绕工作台布置在设备主体上以支撑测试头，使得探测卡与工作台相对。 支撑机构可拆卸地与接合杆接合并通过接合杆支撑测试头。 第一支撑机构具有用于使测试头在垂直方向上移动通过接合杆的升降机构（20）。 当测试头被升降机构移动时，探针卡相对于放置在工作台上的晶片的倾斜度被调整。

    Testing apparatus
    3.
    发明公开
    Testing apparatus 失效
    Testeinrichtung

    公开(公告)号：EP0752588A3

    公开(公告)日：1997-07-23

    申请号：EP96110892.5

    申请日：1996-07-05

    申请人： TOKYO ELECTRON LIMITED

    发明人： Obikane, Tadashi ,  Hayashi, Eiji ,  Koshi, Ryoichiro

    IPC分类号： G01R1/067 ,  G01R31/316

    CPC分类号： G01R1/06705 ,  G01R31/2886

    摘要： A probing apparatus has an apparatus body (1) and a test head (4) detachable from the apparatus body. A probe card having a plurality of probe needles to be brought into contact with a semiconductor wafer (W) is supported by the test head. Three engaging rods (15) are disposed on the test head around the probe card to receive the load of the test head in a distributed manner. A vertically movable work table (5) is disposed on the apparatus body to place a substrate thereon. Two first support mechanisms (11) and one second support mechanism (12) are disposed on the apparatus body around the work table to support the test head such that the probe card opposes the work table. The support mechanisms detachably engage with the engaging rods and support the test head through the engaging rods. The first support mechanisms have elevating mechanisms (20) for moving the test head in the vertical direction through the engaging rods. When the test head is moved by the elevating mechanisms, the inclination of the probe card with respect to the wafer placed on the work table is adjusted.

    摘要翻译： 探测装置具有装置主体（1）和可脱离装置本体的测试头（4）。 具有与半导体晶片（W）接触的多个探针的探针卡被测试头支撑。 三个接合杆（15）设置在探针卡周围的测试头上以分布的方式接收测试头的负载。 一个垂直移动的工作台（5）设置在装置主体上以将基板放置在其上。 两个第一支撑机构（11）和一个第二支撑机构（12）设置在工作台周围的装置主体上，以支撑测试头，使得探针卡与工作台相对。 支撑机构可拆卸地与接合杆接合并且通过接合杆支撑测试头。 第一支撑机构具有用于通过接合杆在垂直方向上移动测试头的升降机构（20）。 当通过升降机构移动测试头时，调整探针卡相对于放置在工作台上的晶片的倾斜度。