Invention Grant
- Patent Title: Assemblage de cartes électroniques, et procédé de fabrication d'un tel assemblage
- Patent Title (English): Assembly of electronic boards, and process for manufacturing such an assembly
- Patent Title (中): 电电路板，以及它们的制备方法的组件
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Application No.: EP96402623.1Application Date: 1996-12-04
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Publication No.: EP0778723B1Publication Date: 1999-11-03
- Inventor: Cadet, Yves , Tutka, André
- Applicant: SAGEM S.A.
- Applicant Address: 6, Avenue d'Iéna 75016 Paris FR
- Assignee: SAGEM S.A.
- Current Assignee: SAGEM S.A.
- Current Assignee Address: 6, Avenue d'Iéna 75016 Paris FR
- Agency: Fort, Jacques
- Priority: FR9514497 19951207
- Main IPC: H05K3/36
- IPC: H05K3/36
Public/Granted literature
- EP0778723A1 Assemblage de cartes électroniques, et procédé de fabrication d'un tel assemblage Public/Granted day:1997-06-11
Information query
