发明公开
EP0821406A3 Method of wire bonding an integrated circuit to an ultra-flexible substrate
失效
Drahtverbindungsverfahren einer integrierten Schaltung a einem ultrabiegsamen Substrat
- 专利标题： Method of wire bonding an integrated circuit to an ultra-flexible substrate
- 专利标题（中）： Drahtverbindungsverfahren einer integrierten Schaltung a einem ultrabiegsamen Substrat
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申请号： EP97112463.1申请日： 1997-07-21
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公开(公告)号： EP0821406A3公开(公告)日： 2000-03-22
- 发明人: Isaacson, Mark R. , Piccoli, Anthony F. , Holloway, Michael
- 申请人： CHECKPOINT SYSTEMS, INC.
- 申请人地址： 101 Wolf Drive, P.O. Box 188 Thorofare, NJ 08086 US
- 专利权人： CHECKPOINT SYSTEMS, INC.
- 当前专利权人： CHECKPOINT SYSTEMS, INC.
- 当前专利权人地址： 101 Wolf Drive, P.O. Box 188 Thorofare, NJ 08086 US
- 代理机构： Menges, Rolf, Dipl.-Ing.
- 优先权： US681195 19960722
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/64
摘要：
A method of electrically connecting an integrated circuit (IC (14)) to at least one electrical conductor on a flexible dielectric substrate (26) having an IC attachment area (36) and at least one resonant circuit formed thereon. The resonant circuit is formed with two conductive patterns disposed on two opposite principal surfaces of the flexible substrate (26). The conductive patterns are electrically connected to each other to form an inductor (22) and a capacitor, with the inductor (22) also functioning as an antenna. The IC attachment area (36) of the flexible substrate (26) is cleaned and the latter is secured in a fixed position in a plenum to prevent substantial movement thereof. The IC (14) is secured to the IC attachment area (36). Wire bonding of the IC (14) to at least one electrical conductor (38, 40, 42) of the resonant circuit is performed. A protective covering is applied over the IC (14) and the wire bond to protect the wire bond from being damaged by external forces.
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