发明公开
EP0911874A2 Management of a lateral deflection amount of a metal wire in a semiconductor device
审中-公开
魔术师魔术师在einer中的Metalldrahtes Halbleitervorrichtung
- 专利标题： Management of a lateral deflection amount of a metal wire in a semiconductor device
- 专利标题（中）： 魔术师魔术师在einer中的Metalldrahtes Halbleitervorrichtung
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申请号： EP98120024.9申请日： 1998-10-22
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公开(公告)号： EP0911874A2公开(公告)日： 1999-04-28
- 发明人: Inaba, Takehito, c/o NEC Corporation
- 申请人： NEC CORPORATION
- 申请人地址： 7-1, Shiba 5-chome Minato-ku Tokyo JP
- 专利权人： NEC CORPORATION
- 当前专利权人： NEC CORPORATION
- 当前专利权人地址： 7-1, Shiba 5-chome Minato-ku Tokyo JP
- 代理机构： Betten & Resch
- 优先权： JP289331/97 19971022
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/56
摘要：
In a semiconductor device, a bus bar (4a) is provided with a projection (9a). Based on a positional relationship between the projection and a metal wire (13a) subjected to the lateral deflection upon resin filling, the metal wire lateral deflection amount is managed. The projection may be provided on a suspension pin or at another portion of a lead frame. A cutout may be provided instead of the projection.
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