发明公开
EP1011111A1 Resistive metal layers and method for making same
失效
Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung
- 专利标题： Resistive metal layers and method for making same
- 专利标题（中）： Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung
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申请号： EP99124541.6申请日： 1989-02-23
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公开(公告)号： EP1011111A1公开(公告)日： 2000-06-21
- 发明人: Clouser, Sidney J. , Lee, Chinho , Prokop, Mary Katherine , Whewell, Christopher J.
- 申请人： Gould Electronics Inc.
- 申请人地址： 34929 Curtis Boulevard Eastlake, Ohio 44095-4001 US
- 专利权人： Gould Electronics Inc.
- 当前专利权人： Gould Electronics Inc.
- 当前专利权人地址： 34929 Curtis Boulevard Eastlake, Ohio 44095-4001 US
- 代理机构： Mallalieu, Catherine Louise
- 优先权： US160794 19880226; US160795 19880226; US307493 19890209
- 主分类号： H01C7/00
- IPC分类号： H01C7/00 ; H01C17/16 ; H05K1/16
摘要：
Electrodeposited planar resistive layers comprising nickel·sulfur and chromium·carbon·oxygen composites are provided. The planar resistors may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 Ω per square.
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