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1.发明公开Resistive metal layers and method for making same 失效Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung。
公开(公告)号：EP0330210A2
公开(公告)日：1989-08-30
申请号：EP89103215.3
申请日：1989-02-23
CPC分类号： H05K1/167 , H01C7/006 , H01C17/16 , H05K3/384 , H05K2201/0323 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723
摘要： Electrodeposited planar resistive layers comprising nickel·sulfur and chromium·carbon·oxygen composites (10) are provided. The planar resistors may be combined with conductive layers (10) and insulative layers (12) to produce laminates (10) useful in the preparation of printed circuit boards. The resistive layers (16) are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 Ω per square.
摘要翻译： 提供了包含镍硫和铬碳氧合物（10）的电沉积平面电阻层。 平面电阻器可以与导电层（10）和绝缘层（12）组合以产生用于制备印刷电路板的层压板（10）。 电阻层（16）由含有通常导电金属成分源和非金属电阻增加添加剂源如氧，碳和/或硫的电镀浴电镀制备。 平面电阻器具有在约15至约1000欧姆每平方的范围内的薄层电阻。
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2.发明公开Resistive metal layers and method for making same 失效Metallische Widerstandsschichten und Verfahren zu ihrer Herstellung
公开(公告)号：EP1011111A1
公开(公告)日：2000-06-21
申请号：EP99124541.6
申请日：1989-02-23
CPC分类号： H05K1/167 , H01C7/006 , H01C17/16 , H05K3/384 , H05K2201/0323 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723
摘要： Electrodeposited planar resistive layers comprising nickel·sulfur and chromium·carbon·oxygen composites are provided. The planar resistors may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 Ω per square.
摘要翻译： 提供了包括镍硫化物和碳氧化合物复合材料的电沉积平面电阻层。 平面电阻器可以与导电层和绝缘层组合以产生用于制备印刷电路板的层压板。 电阻层通过电镀从包含常规导电金属组分的源和非金属电阻增加添加剂源如氧，碳和/或硫的电镀浴制备。 平面电阻器具有在约15至约1000欧姆每平方的范围内的薄层电阻。
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公开(公告)号：EP0330210A3
公开(公告)日：1990-11-07
申请号：EP89103215.3
申请日：1989-02-23
CPC分类号： H05K1/167 , H01C7/006 , H01C17/16 , H05K3/384 , H05K2201/0323 , H05K2201/0355 , H05K2203/0361 , H05K2203/0384 , H05K2203/0723
摘要： Electrodeposited planar resistive layers comprising nickel·sulfur and chromium·carbon·oxygen composites (10) are provided. The planar resistors may be combined with conductive layers (10) and insulative layers (12) to produce laminates (10) useful in the preparation of printed circuit boards. The resistive layers (16) are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive such as oxygen, carbon and/or sulfur. The planar resistors have sheet resistances in the range of from about 15 to about 1000 Ω per square.
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