The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.
In the plating apparatus, an anode 13 is disposed in a plating bath; a substrate 12 is mounted in a jig and disposed in the plating bath opposite the anode 13; and a plurality of feeder contacts 15 is contacting the conductive region formed on the surface of the substrate 12. A predetermined voltage is applied between the anode 13 and feeder contacts 15 to supply a plating current through the feeder contacts 15 for plating the substrate 12. The plating apparatus also includes a conductivity sensor 22 for detecting the state of conductivity between each of the feeder contacts 15 and the conductive region on the substrate 12.