公开(公告)号：EP1029954A1

公开(公告)日：2000-08-23

申请号：EP99943206.5

申请日：1999-09-08

申请人： EBARA CORPORATION

发明人： HONGO, Akihisa ,  OGURE, Naoaki ,  UEYAMA, Hiroyuki ,  YAMAKAWA, Junitsu ,  NAGAI, Mizuki ,  SUZUKI, Kenichi ,  CHONO, Atsushi ,  SENDAI, Satoshi ,  MISHIMA, Koji

IPC分类号： C25D17/00

CPC分类号： C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/02

摘要： An object of the present invention is to provide a substrate plating apparatus employing an insoluble anode, and particularly a substrate plating apparatus capable of easily and automatically supplying metal ions.
It is another object of the present invention to provide a substrate plating apparatus capable of supplying a uniform primary current distribution between the cathode and anode and facilitating reduction of the size of the plating apparatus.
It is further another object of the present invention to provide a plating apparatus capable of preventing the substrate from being contaminated by particles produced from black film, even when using a soluble anode.
The present invention relates to a substrate plating apparatus for plating a substrate in a plating bath containing plating solution, an insoluble anode being disposed in the plating bath opposite the substrate, the substrate plating apparatus comprising: a circulating vessel or dummy vessel provided separate from the plating bath, a soluble anode and a cathode being disposed in the circulating vessel or dummy vessel, an anion exchange film or selective cation exchange film being disposed between the anode and cathode and isolating the same; wherein metal ions are generated in the circulating vessel or dummy vessel by flowing current between the soluble anode and the cathode therein, and generated metal ions are supplied to the plating bath.
A substrate plating apparatus comprises an ion exchange film or neutral porous diaphragm disposed between the substrate and anode in the plating bath; wherein the ion exchange film or neutral porous diaphragm divides the plating bath into a substrate region and an anode region.

公开(公告)号：EP1048755A1

公开(公告)日：2000-11-02

申请号：EP98961353.4

申请日：1998-12-16

申请人： Ebara Corporation

发明人： YOSHIOKA, Junichiro ,  SENDAI, Satoshi ,  CHONO, Atsushi ,  TADA, Mitsuo ,  HONGO, Akihisa ,  MUKAIYAMA, Yoshitaka ,  TOMIOKA, Kenya ,  OGATA, Akira ,  SUZUKI, Kenichi ,  OZAWA, Naomitsu

IPC分类号： C25D17/08 ,  C25D5/08 ,  C25D21/12 ,  G01R27/02

CPC分类号： G01R31/026 ,  C25D21/12

摘要： The present invention provides a conductivity sensing device capable of detecting the conductivity (contact state) of the plurality of feeder contacts contacting the conductive area of the substrate, and a plating apparatus capable of forming a plating film of uniform thickness by supplying a uniform plating current through a plurality of feeder contacts.
In the plating apparatus, an anode 13 is disposed in a plating bath; a substrate 12 is mounted in a jig and disposed in the plating bath opposite the anode 13; and a plurality of feeder contacts 15 is contacting the conductive region formed on the surface of the substrate 12. A predetermined voltage is applied between the anode 13 and feeder contacts 15 to supply a plating current through the feeder contacts 15 for plating the substrate 12. The plating apparatus also includes a conductivity sensor 22 for detecting the state of conductivity between each of the feeder contacts 15 and the conductive region on the substrate 12.

摘要翻译： 本发明提供一种电导率检测装置，其能够检测与基板的导电区域接触的多个馈电触头的导电性（接触状态），以及能够通过提供均匀电镀电流形成均匀厚度的镀膜的电镀装置 通过多个馈线接触。 在电镀装置中，阳极13设置在镀浴中; 基板12安装在夹具中并且设置在与阳极13相对的电镀槽中; 并且多个馈电触头15与形成在基板12的表面上的导电区域接触。在阳极13和馈电触头15之间施加预定电压，以通过馈电触头15提供电镀电流，以电镀基板12。 电镀装置还包括用于检测馈电触头15和基板12上的导电区域之间的导电性状态的电导率传感器22。