发明公开
EP1063737A3 Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules
有权
一种用于连接电路板和制造数据载体和装置的电子部件模块的组装方法
- 专利标题： Method for joining wiring boards and manufacturing data carrier and device for mounting electronic component modules
- 专利标题（中）： 一种用于连接电路板和制造数据载体和装置的电子部件模块的组装方法
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申请号： EP00113012.9申请日： 2000-06-21
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公开(公告)号： EP1063737A3公开(公告)日： 2005-06-08
- 发明人: Kawai, Wakahiro , Okuda, Masanobu
- 申请人： OMRON CORPORATION
- 申请人地址： 10, Tsuchido-cho, Hanazono, Ukyo-ku Kyoto JP
- 专利权人： OMRON CORPORATION
- 当前专利权人： OMRON CORPORATION
- 当前专利权人地址： 10, Tsuchido-cho, Hanazono, Ukyo-ku Kyoto JP
- 代理机构： Käck, Jürgen, Dipl.-Ing.
- 优先权： JP17602299 19990622
- 主分类号： H05K3/36
- IPC分类号： H05K3/36 ; H01R43/02 ; G06K19/077
摘要：
A method for joining a first wiring board (100) covered with a conductive pattern (102) on a surface of a thin resin basic plate (104) to a second wiring board (200) covered with a conductive pattern (202) on a thin resin basic plate (204) to ensure the electric connection therebetween, comprising the steps of putting the first and second wiring boards (100 and 200) together in a confront relationship so as to adjust join predetermined portions (103 and 203) on the conductive patterns, catching the join predetermined portions (103 and 203) in the status by a pair of ultrasonic welding tools (40 and 41), and applying an ultrasonic vibration to the ultrasonic welding tools (40 or 41) to weld the conductive metals located on the join predetermined portions (103 and 203).
公开/授权文献
- EP1063737B1 Method for manufacturing a film-type data carrier 公开/授权日：2009-01-07
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