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    CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME
    1.
    发明公开
    CIRCUIT BOARD AND CHIP PACKAGE COMPRISING SAME 审中-公开

    公开(公告)号：EP4514075A1

    公开(公告)日：2025-02-26

    申请号：EP23936785.7

    申请日：2023-06-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： ROH, Myoung Lae ,  KIM, Kab Young ,  JO, Min Sung

    IPC: H05K1/09 ,  H05K3/38 ,  G06K19/077

    Abstract: A circuit board according to an embodiment comprises a first metal layer; and a second metal layer disposed on the first metal layer, wherein the first metal layer includes an oxide layer formed by oxidizing a region at a predetermined depth from a lower surface of the first metal layer, the first metal layer and the second metal layer include a plurality of electrode patterns disposed on the oxide layer and spaced apart from each other, and the oxide layer insulates between the plurality of electrode patterns.

    ELECTRONIC CARD HAVING AN ELECTRONIC INTERFACE
    4.
    发明公开
    ELECTRONIC CARD HAVING AN ELECTRONIC INTERFACE 审中-公开

    公开(公告)号：EP4468316A3

    公开(公告)日：2025-02-19

    申请号：EP24194235.8

    申请日：2019-08-23

    Applicant: Apple Inc.

    Inventor： RUSSELL-CLARKE, Peter N. ,  DIONELLO, Rafael L.

    IPC: G06K19/07 ,  G06K19/06 ,  G06K19/02 ,  G06K19/077 ,  B42D25/373 ,  B42D25/369 ,  B42D25/455 ,  B42D25/46 ,  G06K19/08 ,  H01F41/32

    Abstract: There is provided an electronic card (100) comprising: a substrate defining a recess (108) formed into a front surface (110); an integrated circuit (106) positioned in the recess of the substrate; and a contact plate (102, 602b, 602d) positioned over the integrated circuit. The contact plate (102, 602b, 602d) comprises: a plate substrate (610b, 610d); an array of terminal electrodes (642b, 662d) disposed on a surface of the plate substrate (610b, 610d), each terminal electrode of the array of terminal electrodes offset from an edge of the plate substrate (610b, 610d); and a conductive material (630b, 630d) disposed on the surface of the plate substrate (610b, 610d) and defining an array of openings, each respective terminal electrode (642b, 662d) positioned in and completely surrounded about its perimeter by a respective opening of the array of openings.

    CONTACTLESS CARD AND METHOD OF ASSEMBLY
    10.
    发明公开
    CONTACTLESS CARD AND METHOD OF ASSEMBLY 审中-公开

    公开(公告)号：EP4455935A3

    公开(公告)日：2025-01-22

    申请号：EP24187126.8

    申请日：2020-11-30

    Applicant: Capital One Services, LLC

    Inventor： OSBORN, Kevin ,  WURMFELD, David

    IPC: G06K19/077

    Abstract: A method of forming a contactless transaction card. The method may include providing a card body, defining a window, and attaching an antenna assembly layer to the card body, where the antenna assembly layer includes an antenna, a set of curable connectors, disposed on a set of end regions of the antenna within the window, and a UV-transparent layer, supporting the antenna. The method may include providing a contactless chip module within the window on a first side of the antenna assembly layer, and directing radiation through the UV-transparent layer, wherein the contactless chip module is electrically connected to the antenna via the curable connectors.

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