发明公开
- 专利标题： Grinding spindle with dual tool mounting means
- 专利标题（中）： 双刀架磨削主轴
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申请号： EP00128457.9申请日： 2000-12-22
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公开(公告)号： EP1112812A2公开(公告)日： 2001-07-04
- 发明人: Okuyama, Tetsuo , Murai, Shirou , Saita, Kunihiro , Wada, Toyotaka , Kawatsu, Tomoyuki
- 申请人： Nippei Toyama Corporation
- 申请人地址： 26-2, Minami-Oi 6-chome Shinagawa-ku, Tokyo-to 140-0013 JP
- 专利权人： Nippei Toyama Corporation
- 当前专利权人： Nippei Toyama Corporation
- 当前专利权人地址： 26-2, Minami-Oi 6-chome Shinagawa-ku, Tokyo-to 140-0013 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权： JP36903799 19991227; JP37014999 19991227; JP37210899 19991228; JP2000346187 20001114; JP2000346188 20001114
- 主分类号： B24B41/04
- IPC分类号： B24B41/04 ; B24B45/00 ; B23Q3/155
摘要：
A finishing grindstone member 20 is fixed to a spindle 10 by a bolt. In the spindle 10, there is formed a tool mounting portion 25 into which a rough grindstone member can be mounted. Into the tool mounting portion 25, there can be mounted not only the rough grindstone member but also a cover member 36. After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member 20, the cover member 36 is mounted onto the tool mounting portion 25 to thereby prevent the tool mounting portion 25 from being soiled.
公开/授权文献
- EP1112812A3 Grinding spindle with dual tool mounting means 公开/授权日：2003-10-15
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