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49 条记录 (耗时 0.014 秒)

    Grinding spindle with dual tool mounting means
    2.
    发明公开
    Grinding spindle with dual tool mounting means 审中-公开
    Schleifspindel mit doppelter Werkzeughaltevorrichtung

    公开(公告)号：EP1112812A3

    公开(公告)日：2003-10-15

    申请号：EP00128457.9

    申请日：2000-12-22

    申请人： Nippei Toyama Corporation

    发明人： Okuyama, Tetsuo ,  Murai, Shirou ,  Saita, Kunihiro ,  Wada, Toyotaka ,  Kawatsu, Tomoyuki

    IPC分类号： B24B41/04 ,  B24B45/00 ,  B23Q3/155 ,  B24D13/14 ,  B24B9/06

    CPC分类号： B24B41/047 ,  B24B7/228 ,  B24B45/00 ,  Y10T483/10 ,  Y10T483/17 ,  Y10T483/1736 ,  Y10T483/174

    摘要： A finishing grindstone member 20 is fixed to a spindle 10 by a bolt. In the spindle 10, there is formed a tool mounting portion 25 into which a rough grindstone member can be mounted. Into the tool mounting portion 25, there can be mounted not only the rough grindstone member but also a cover member 36. After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member 20, the cover member 36 is mounted onto the tool mounting portion 25 to thereby prevent the tool mounting portion 25 from being soiled.

    摘要翻译： 精加工磨石构件20通过螺栓固定在心轴10上。 在主轴10中，形成有可以安装粗磨石构件的工具安装部25。 在工具安装部25中，不仅可以安装粗磨石构件，而且还可以安装盖构件36.在使用粗磨石构件粗略研磨硅晶片之后，当使用精加工磨石构件20对硅树脂硅片进行精磨时， 盖构件36安装在工具安装部25上，从而防止工具安装部25弄脏。

    Wire saw
    4.
    发明公开
    Wire saw 失效
    线锯

    公开(公告)号：EP1068920A3

    公开(公告)日：2001-02-07

    申请号：EP00203452.8

    申请日：1995-09-29

    申请人： Nippei Toyama Corporation

    发明人： Shiraga, Mitsuhiro ,  Osawa, Hitoshi ,  Ito, Yasuhiro ,  Katsumata, Noboru ,  Adachi, Toshiharu ,  Uchikawa, Junichi ,  Kinutani, Kazutomo ,  Moriyama, Yasuhiko

    IPC分类号： B23D57/00

    CPC分类号： B65H75/148 ,  B23D57/0053 ,  B23D57/0069 ,  B24B27/0633 ,  B28D5/045 ,  B65H2701/354 ,  B65H2701/513 ,  B65H2701/515

    摘要： The wire saw includes a pair of reel bobbins (46,47). A strand of wire (37) is unwound from one of the reel bobbins (46,47) and wound about a plurality of cutting rollers (33,34), which constitute a cutting device (31). The wire is simultaneously wound about the other reel bobbin (47,46) while rotating the cutting rollers (33,34) to cause the wire (37) to travel. A cutting feed is applied to the wire (37) to cut the workpiece (30). The wire saw includes reel motors (48,49), which rotate the associated reel bobbins (46,47), a sensor (61,62), which detects the tension fluctuation of the wire (37), a compensating device, which alters the rotating speed of the reel motors (48,49) in correspondence with the detection data of the sensor (61,62). The wire saw further includes an altering device, which alters a compensation coefficient for altering the rotating speed of the reel motors (48,49) in correspondence with the winding diameter of the reel bobbins (46,47).

    Wire saw
    5.
    发明公开
    Wire saw 失效
    线锯

    公开(公告)号：EP1068920A2

    公开(公告)日：2001-01-17

    申请号：EP00203452.8

    申请日：1995-09-29

    申请人： Nippei Toyama Corporation

    发明人： Shiraga, Mitsuhiro ,  Osawa, Hitoshi ,  Ito, Yasuhiro ,  Katsumata, Noboru ,  Adachi, Toshiharu ,  Uchikawa, Junichi ,  Kinutani, Kazutomo ,  Moriyama, Yasuhiko

    IPC分类号： B23D57/00

    CPC分类号： B65H75/148 ,  B23D57/0053 ,  B23D57/0069 ,  B24B27/0633 ,  B28D5/045 ,  B65H2701/354 ,  B65H2701/513 ,  B65H2701/515

    摘要： The wire saw includes a pair of reel bobbins. A strand of wire is unwound from one of the reel bobbins and wound about a plurality of cutting rollers, which constitute a cutting device. The wire is simultaneously wound about the other reel bobbin while rotating the cutting rollers to cause the wire to travel. A cutting feed is applied to the wire to cut the workpiece. The wire saw includes reel motors, which rotate the associated reel bobbins, a sensor, which detects the tension fluctuation of the wire, compensating device, which alters the rotating speed of the reel motors in correspondence with the detection data of the sensor. The wire saw further includes an altering device, which alters a compensation coefficient for altering the rotating speed of the reel motors in correspondence with the winding diameter of the reel bobbins.

    摘要翻译： 线锯包括一对卷筒。 一股导线从其中一个绕线筒展开并缠绕在构成切割装置的多个切割辊上。 在旋转切割滚筒的同时，导线同时缠绕在另一个卷筒上，以使导线行进。 切割进给被应用到导线切开工件。 线锯包括使相关的绕线筒转动的卷筒马达，检测导线张力波动的传感器，补偿装置根据传感器的检测数据改变卷筒马达的转速。 线锯进一步包括改变装置，该改变装置根据卷筒的卷绕直径改变用于改变卷筒马达的转速的补偿系数。

    Method for chamfering a wafer
    8.
    发明公开
    Method for chamfering a wafer 审中-公开
    Verfahren zum Anfasen einer Halbleiterscheibe

    公开(公告)号：EP0950466A3

    公开(公告)日：2003-03-05

    申请号：EP99107113.5

    申请日：1999-04-12

    申请人： Nippei Toyama Corporation

    发明人： Nishi, Kenichiro c/o Nippei Toyama Corporation ,  Murai, Shiro c/o Nippei Toyama Corporation

    IPC分类号： B24B9/06

    CPC分类号： H01L21/02021 ,  B24B9/065 ,  B24D5/02

    摘要： In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3. Especially, the present wafer chamfering method comprises two steps: that is, a circumferential portion grinding step in which the grindstone is supported such that it stands upright or at right angles to the circumferential portion 6 of the wafer 3 at their respective mutual contact points and only the flat portion of the grindstone 8 is contacted with the mutual contact points to thereby chamfer the peripheral edge portion of the wafer 3; and, a notch portion grinding step in which the grindstone is supported such that it is inclined with respect to the diameter direction of the notch portion of the wafer 3 by an angle of about 45° in the circumferential direction of the wafer 3 and the edge portions 5 or both of the edge portions 5 and flat portion 2 are used to chamfer the notch portion 4 of the wafer 3.

    摘要翻译： 在晶片倒角方法中，使用盘状磨石8，其包括：作为研磨面1的周缘部; 在研磨面1的宽度方向的中央部形成的平坦部， 以及分别形成在平坦部2的宽度方向的两侧的两个边缘部5，并且形成为要倒角的盘状晶片3的切口部4的谷部的形状。 在操作中，在晶片倒角方法中，在旋转上述砂轮8的同时，磨石8沿着晶片3的厚度方向旋转，从而使晶片3倒角。特别地，本晶片倒角法包括两个步骤： 圆周部分研磨步骤，其中所述磨石被支撑成使得其在其相应的相互接触点处直立或与所述晶片3的周向部分6成直角，并且仅所述磨石8的平坦部分与所述相互接触 从而使晶片3的周边部分倒角; 以及切屑部研磨工序，其中所述磨石被支撑成使得其相对于所述晶片3的所述切口部分的直径方向在所述晶片3的圆周方向上以约45°的角度倾斜，并且所述边缘 边缘部分5和平坦部分2的部分5或两者用于倒角晶片3的切口部分4.

    Grinder and grinding method
    10.
    发明公开
    Grinder and grinding method 失效
    Schleifmaschine und Verfahren

    公开(公告)号：EP0868968A3

    公开(公告)日：2000-07-19

    申请号：EP98105554.4

    申请日：1998-03-26

    申请人： Nippei Toyama Corporation

    发明人： Nishi, Kenichiro ,  Nukui, Mitsuru ,  Nakajima, Kazuo ,  Murai, Shirou ,  Wada, Toyotaka

    IPC分类号： B24B7/22 ,  B24B41/04 ,  B24B49/16 ,  B24B7/17 ,  B23Q1/70

    CPC分类号： B24B7/228 ,  B24B41/04 ,  B24B49/16

    摘要： A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

    摘要翻译： 砂轮28的主轴23通过静压止推轴承26和27的用于砂轮的台架22旋转地承载。压力调节器38用于调节必须供应至至少任一个供给口26a和27a的压力 在静压推力轴承26和27中设置在主轴23的轴线方向上的彼此。 压力调节器38具有用于改变用于阻塞流体的通道和阻塞通道的长度的改变构件。