发明公开
- 专利标题： VERFAHREN ZUR EINGEHÄUSUNG ELEKTRONISCHER BAUELEMENTE
- 专利标题（英）： Method for housing electronic components
- 专利标题（中）： 电子元件EINGEHÄUSUNG方法
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申请号： EP99957956.8申请日： 1999-10-30
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公开(公告)号： EP1147553A1公开(公告)日： 2001-10-24
- 发明人: LEITER, Manfred , WEIBLEN, Kurt , LUCAS, Bernhard , SCHATZ, Frank , BEEZ, Thomas , SEIZ, Juergen , BAUMANN, Helmut , MOERSCH, Gilbert , OLBRISCH, Herbert , EISENSCHMID, Heinz , MOESS, Eberhard , DUTZI, Joachim , KUGLER, Andreas
- 申请人： ROBERT BOSCH GMBH
- 申请人地址： Postfach 30 02 20 70442 Stuttgart DE
- 专利权人： ROBERT BOSCH GMBH
- 当前专利权人： ROBERT BOSCH GMBH
- 当前专利权人地址： Postfach 30 02 20 70442 Stuttgart DE
- 优先权： DE19856331 19981207
- 国际公布： WO0035001 20000615
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/52 ; H01L23/14
摘要：
The inventive method for housing electronic components comprises the following steps: configuring a plurality of cavities (6) in a housing substrate (2; 20); placing the electronic components (8) in the cavities (6); sealing the cavities (6) with a cover layer or a cover substrate (4); and separating these packed components (8). This enables a number of component housings to be produced simultaneously, economically. According to one variant of the method, the components are also arranged on a component support layer (16) and are placed in the cavities (6) by joining the housing substrate (2; 20) and the component support layer (16).
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