公开(公告)号：EP1147553A1

公开(公告)日：2001-10-24

申请号：EP99957956.8

申请日：1999-10-30

申请人： ROBERT BOSCH GMBH

发明人： LEITER, Manfred ,  WEIBLEN, Kurt ,  LUCAS, Bernhard ,  SCHATZ, Frank ,  BEEZ, Thomas ,  SEIZ, Juergen ,  BAUMANN, Helmut ,  MOERSCH, Gilbert ,  OLBRISCH, Herbert ,  EISENSCHMID, Heinz ,  MOESS, Eberhard ,  DUTZI, Joachim ,  KUGLER, Andreas

IPC分类号： H01L21/50 ,  H01L21/52 ,  H01L23/14

CPC分类号： H01L21/50

摘要： The inventive method for housing electronic components comprises the following steps: configuring a plurality of cavities (6) in a housing substrate (2; 20); placing the electronic components (8) in the cavities (6); sealing the cavities (6) with a cover layer or a cover substrate (4); and separating these packed components (8). This enables a number of component housings to be produced simultaneously, economically. According to one variant of the method, the components are also arranged on a component support layer (16) and are placed in the cavities (6) by joining the housing substrate (2; 20) and the component support layer (16).