公开(公告)号：EP1147553A1

公开(公告)日：2001-10-24

申请号：EP99957956.8

申请日：1999-10-30

申请人： ROBERT BOSCH GMBH

发明人： LEITER, Manfred ,  WEIBLEN, Kurt ,  LUCAS, Bernhard ,  SCHATZ, Frank ,  BEEZ, Thomas ,  SEIZ, Juergen ,  BAUMANN, Helmut ,  MOERSCH, Gilbert ,  OLBRISCH, Herbert ,  EISENSCHMID, Heinz ,  MOESS, Eberhard ,  DUTZI, Joachim ,  KUGLER, Andreas

IPC分类号： H01L21/50 ,  H01L21/52 ,  H01L23/14

CPC分类号： H01L21/50

摘要： The inventive method for housing electronic components comprises the following steps: configuring a plurality of cavities (6) in a housing substrate (2; 20); placing the electronic components (8) in the cavities (6); sealing the cavities (6) with a cover layer or a cover substrate (4); and separating these packed components (8). This enables a number of component housings to be produced simultaneously, economically. According to one variant of the method, the components are also arranged on a component support layer (16) and are placed in the cavities (6) by joining the housing substrate (2; 20) and the component support layer (16).

公开(公告)号：EP1831662A1

公开(公告)日：2007-09-12

申请号：EP05813635.9

申请日：2005-11-04

申请人： ROBERT BOSCH GMBH

发明人： BENZEL, Hubert ,  FINKBEINER, Stefan ,  FISCHER, Frank ,  BAUMANN, Helmut ,  METZGER, Lars ,  SCHEUERER, Roland ,  BRAUCHLE, Peter ,  FEUSTEL, Andreas ,  NEUBAUER, Matthias

IPC分类号： G01L9/00

CPC分类号： G01L9/0073

摘要： The invention relates to a method for producing a micromechanical sensor element, which can be configured with a monolithic integrated construction and is capable of the capacitive detection of a physical variable. In addition to said production method, the invention also relates to a micromechanical device containing a sensor element of this type, such as a pressure sensor or an acceleration sensor.