The invention relates to electrically conductive connections between individuals contacts of electronic components having electrically conductive conductor structures configured on a substrate. The invention is based on the known flip chip technology and aims at providing the possibility of achieving a cost-effective and better transfer safety in an electrically conductive connection between the contacts of electronic components and conductor structures consisting of an electrically conductive material. To this end, electronic components are used whose connection bumps are configured by currentless deposition primarily of palladium. The connection bumps project beyond the base of the component, are directly pressed on the conductor structure and permanently connected to the substrate by means of a material or a polymer film exerting a pressure or tensile force as a result of volume reduction.