公开(公告)号：EP1133796A1

公开(公告)日：2001-09-19

申请号：EP99960780.7

申请日：1999-10-12

申请人： KSW Microtec Gesellschaft für Angewandte Mikrotechnik mbH Dresden

发明人： SEIDOWSKI, Thomas ,  KRIEBEL, Frank

IPC分类号： H01L23/498 ,  G06K19/077

CPC分类号： G06K19/07779 ,  G06K19/07749 ,  G06K19/07783 ,  G06K19/08 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K1/095 ,  H01L2924/00

摘要： The invention relates to a two-dimensional support which is comprised of a flexible, dielectric material. At least one semiconductor chip having a conducting path structure especially for carrying out contactless data transmission is placed on said support. The invention also relates to a method for producing the two-dimensional support and to the use thereof. Such a support for semiconductor chips and a method for the production thereof should make it possible to easily and economically provide or produce elements for carrying out contactless data transmission. To this end, the conducting path structure (3) comprised of an electrically conductive polymer or adhesive is directly pressed onto the support (1). Particularly suited supports are paper, cardboard, paperboard or a textile material.

公开(公告)号：EP1155445A1

公开(公告)日：2001-11-21

申请号：EP00914028.6

申请日：2000-02-11

申请人： KSW Microtec Gesellschaft für Angewandte Mikrotechnik mbH Dresden

发明人： SEIDOWSKI, Thomas ,  KRIEBEL, Frank ,  SADOWSKI, Günter

IPC分类号： H01L21/60 ,  H01L21/56 ,  C23C18/44

CPC分类号： H05K3/325 ,  H01L21/563 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13016 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664

摘要： The invention relates to electrically conductive connections between individuals contacts of electronic components having electrically conductive conductor structures configured on a substrate. The invention is based on the known flip chip technology and aims at providing the possibility of achieving a cost-effective and better transfer safety in an electrically conductive connection between the contacts of electronic components and conductor structures consisting of an electrically conductive material. To this end, electronic components are used whose connection bumps are configured by currentless deposition primarily of palladium. The connection bumps project beyond the base of the component, are directly pressed on the conductor structure and permanently connected to the substrate by means of a material or a polymer film exerting a pressure or tensile force as a result of volume reduction.