发明公开
EP1170802A3 Semiconductor gate with semi-insulating diffusion barrier
审中-公开
Halbletiergatter mit einer halbisolierenden Diffusionsbarriere
- 专利标题: Semiconductor gate with semi-insulating diffusion barrier
- 专利标题(中): Halbletiergatter mit einer halbisolierenden Diffusionsbarriere
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申请号: EP01305503.3申请日: 2001-06-25
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公开(公告)号: EP1170802A3公开(公告)日: 2003-09-10
- 发明人: Clevenger, Lawrence Alfred , Mandelman, Jack A. , Jammy, Rajaro , Gluschenkov, Oleg , McStay, Irene Lennox , Wong, Kwong Hon , Faltermeier, Jonathan
- 申请人: International Business Machines Corporation
- 申请人地址: New Orchard Road Armonk, NY 10504 US
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: New Orchard Road Armonk, NY 10504 US
- 代理机构: Davies, Simon Robert
- 优先权: US613197 20000707
- 主分类号: H01L29/49
- IPC分类号: H01L29/49
摘要:
A gate structure is disclosed for a semiconductor device, and particularly a MOSFET for such applications as CMOS technology. The gate structure entails an electrical insulating layer 14 on a semiconductor substrate 12, over which a polysilicon gate electrode 16 is formed. The gate structure further includes a gate conductor 18 that is electrically connected with the gate electrode through a diffusion barrier layer 20 having semi-insulating properties. The composition and thickness of the diffusion barrier layer are tailored so that the barrier layer is effective to block diffusion and intermixing between the gate conductor and polysilicon gate electrode, yet provides sufficient capacitive coupling and/or current leakage so as not to significantly increase the gate propagation delay of the gate structure.
公开/授权文献
- EP1170802A2 Semiconductor gate with semi-insulating diffusion barrier 公开/授权日:2002-01-09
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