发明公开
- 专利标题： SOLDER-PASTE PRINTING DEVICE AND PRINTING METHOD
- 专利标题（中）： 方法和设备印刷焊锡膏
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申请号： EP00946477申请日： 2000-07-25
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公开(公告)号： EP1203662A4公开(公告)日： 2005-09-21
- 发明人: ONISHI HIROAKI , MIMURA TOSHINORI , CHIKAHISA NAOICHI , TAKAHASHI KEN , MURAKAMI TOSHIYUKI , NAKAHIRA HITOSHI , NAGASHIMA SADAYUKI
- 申请人： MATSUSHITA ELECTRIC IND CO LTD
- 专利权人： MATSUSHITA ELECTRIC IND CO LTD
- 当前专利权人： MATSUSHITA ELECTRIC IND CO LTD
- 优先权： JP21133099 1999-07-26; JP25214899 1999-09-06; JP31538499 1999-11-05; JP34771499 1999-12-07; JP2000220873 2000-07-21
- 主分类号： B41F15/46
- IPC分类号： B41F15/46 ; H05K1/02 ; H05K3/00 ; H05K3/12 ; H05K3/26 ; B41F15/40
摘要：
When solder paste passes through a first gap (34) between a pressure imparting member (28) and a printing mask (3) at a solder-paste printing, a pressure directed toward the printing mask is imparted from the pressure imparting member to the solder paste.
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