发明公开
- 专利标题： Plating bath analysis
- 专利标题（中）： 电镀浴分析
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申请号： EP01309045.1申请日： 2001-10-24
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公开(公告)号： EP1203950A1公开(公告)日： 2002-05-08
- 发明人: Sonnenberg, Wade , Kapeckas, Mark J. , Jacques, David J. , Cruz, Raymond , Barstad, Leon R. , Najjar, Elie H. , Step, Eugene N. , Binstead, Robert A.
- 申请人： Shipley Company LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Shipley Company LLC
- 当前专利权人： Shipley Company LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Kent, Venetia Katherine
- 优先权： US245311P 20001102
- 主分类号： G01N27/42
- IPC分类号： G01N27/42
摘要：
Disclosed are methods for determining the quantity of lcveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
公开/授权文献
- EP1203950B1 Plating bath analysis 公开/授权日：2005-09-07
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