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    Electroplating process
    1.
    发明公开
    Electroplating process 失效
    电镀工艺

    公开(公告)号：EP0883331A3

    公开(公告)日：2001-08-16

    申请号：EP98109457.6

    申请日：1998-05-25

    申请人： Shipley Company LLC

    发明人： Couble, Edward C. ,  Kapeckas, Mark J. ,  Florio. Steven M. ,  Jacques, David L.

    IPC分类号： H05K3/42 ,  C25D5/54

    摘要： A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single aqueous solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.

    摘要翻译： 通过用碳质颗粒涂层涂覆基材来电镀基材的方法。 该方法的特征在于预处理程序，该程序包括底物与含有还原剂和聚电解质的单一水溶液的接触。 单一解决方案的使用降低了印刷电路制造中互连缺陷的发生率。

    Plating bath and method for depositing a metal layer on a substrate
    5.
    发明公开
    Plating bath and method for depositing a metal layer on a substrate 审中-公开
    Beschichtungsbad und Methode zur Abscheidung einer Metallschicht auf einem Substrat

    公开(公告)号：EP1308541A1

    公开(公告)日：2003-05-07

    申请号：EP01308480.1

    申请日：2001-10-04

    申请人： Shipley Company LLC

    发明人： Cobley, Andrew J. ,  Kapeckas, Mark J. ,  Reddington, Erik ,  Sonnenberg, Wade ,  Gabe, David R. ,  Buckley, Thomas ,  Barstad, Leon R.

    IPC分类号： C25D3/38 ,  C25D3/02 ,  C25D3/26 ,  C23C18/16

    CPC分类号： C25D3/38 ,  C25D3/02 ,  H05K3/242

    摘要： A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brighteness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.

    摘要翻译： 金属电镀浴和在基板上镀金属的方法。 金属镀浴含有羟胺，其抑制添加剂浴组分的消耗以提高金属电镀工艺的效率。 将添加剂浴组分添加到金属电镀浴中以改善电镀金属的光泽度以及镀液的微投和抛光力。 除了增白剂之外，添加剂浴组分可以包括矫平剂，抑制剂，硬化剂等。 抑制添加剂消耗的羟胺可以用于镀铜，金，银，铂，钯，钴，镉，镍，铋，铟，锡，铑，铱，钌及其合金的金属电镀浴中。