发明公开
EP1223612A4 SEMICONDUCTOR DEVICE MOUNTING CIRCUIT BOARD, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING MOUNTING STRUCTURE USING THE SAME
审中-公开
电路板的半导体元件和组装厂用于电路板及其HERSTELLLUNGSMETHODE生产
- 专利标题： SEMICONDUCTOR DEVICE MOUNTING CIRCUIT BOARD, METHOD OF PRODUCING THE SAME, AND METHOD OF PRODUCING MOUNTING STRUCTURE USING THE SAME
- 专利标题（中）： 电路板的半导体元件和组装厂用于电路板及其HERSTELLLUNGSMETHODE生产
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申请号： EP01930048申请日： 2001-05-11
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公开(公告)号： EP1223612A4公开(公告)日： 2005-06-29
- 发明人: ONO MASAHIRO , SHIRAISHI TSUKASA
- 申请人： MATSUSHITA ELECTRIC IND CO LTD
- 专利权人： MATSUSHITA ELECTRIC IND CO LTD
- 当前专利权人： MATSUSHITA ELECTRIC IND CO LTD
- 优先权： JP2000140072 2000-05-12
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/498 ; H05K3/32 ; H01L23/29
摘要：
A semiconductor mounting structure which does not cause characteristic degradation of semiconductor devices, wire breakage of wiring, or the like during mounting of semiconductor devices on circuit boards. A mounting structure comprising a circuit board with a semiconductor device mounted thereon, wherein a projecting electrode of the semiconductor device is arranged on the input/output terminal electrode of the circuit board and bonded thereto for electric and mechanical connection by a conductive adhesive, and the semiconductor device and circuit board are fixedly bonded by a resin film preformed on the board surface. This enables mounting without causing damage to the semiconductor functional parts or wiring and with lower load than in the conventional anisotropic conductive film; therefore, high-productivity low-cost thermo-compression bonding mounting can be applied.
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