发明公开
- 专利标题： HARDENING FLUX, SOLDERING RESIST, SEMICONDUCTOR PACKAGE REINFORCED BY HARDENING FLUX, SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 焊料，阻焊剂，半导体HOUSING加强通过焊料，半导体元件和方法半导体住房与半导体元件
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申请号： EP00987764申请日： 2000-12-27
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公开(公告)号： EP1252966A4公开(公告)日： 2004-11-03
- 发明人: HOSOMI TAKESHI , OKADA RYOUICHI , NAKAMURA KENSUKE , TAKAHASHI TOYOSEI
- 申请人： SUMITOMO BAKELITE CO
- 专利权人： SUMITOMO BAKELITE CO
- 当前专利权人： SUMITOMO BAKELITE CO
- 优先权： JP37177499 1999-12-27; JP2000019346 2000-01-27
- 主分类号： B23K35/22
- IPC分类号： B23K35/22 ; B23K35/36 ; H01L21/56 ; H01L21/60 ; H05K3/28 ; H05K3/34 ; B23K35/363
摘要：
A hardening flux acting as a flux during soldering and, when hardened by heating, acting as a reinforcing material for the soldered joint; a soldering resist; a semiconductor package wherein the hardening flux is applied to the circuit exposed surface, solder balls are joined and the solder ball joint is reinforced by the flux which is hardened by heating; a semiconductor device wherein said hardening flux is applied to a semiconductor mounting board having a soldering land and is soldered, and wherein the flux, which is hardened by heating, reinforces the solder joint; and a method of producing said package and said device. A hardening flux which acts as a flux in soldering a semiconductor package to a semiconductor mounting board and which, after soldering, is hardened by further heating to serve as a reinforcing agent for the solder joint; a soldering resist; a semiconductor package reinforced by the hardening flux; a semiconductor device; and a method of producing said semiconductor package and semiconductor device.
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