公开(公告)号：EP2154570A4

公开(公告)日：2010-07-21

申请号：EP08764962

申请日：2008-05-27

申请人： SUMITOMO BAKELITE CO

发明人： TAKAYAMA RIE ,  TAKAHASHI TOYOSEI

IPC分类号： G03F7/027 ,  C09J4/02 ,  C09J7/02 ,  C09J11/04 ,  C09J163/00 ,  G03F7/004 ,  H01L21/027

CPC分类号： G03F7/0388 ,  C08L63/00 ,  C08L2666/22 ,  C09J4/00 ,  C09J7/35 ,  C09J163/00 ,  C09J163/10 ,  C09J2205/31 ,  C09J2461/00 ,  G03F7/027 ,  G03F7/40 ,  Y10T428/2809 ,  Y10T428/31935 ,  C08F220/30

摘要： A photosensitive adhesive resin composition includes (A) a compound having a hydroxyl group or a carboxyl group, and a (meth)acryloyl group, (B) a resin which cures with the compound (A) by thermal treatment, (C) a compound having a (meth)acryloyl group and not having a hydroxyl group and a carboxyl group, (D) a phenol resin or a phenol compound, and (E) a photoactive compound. The photosensitive adhesive resin composition has excellent developability, and is used for producing a spacer formed between a transparent substrate and a substrate on which a semiconductor element is formed. An adhesive film and a light-receiving device are produced using the photosensitive adhesive resin composition.

公开(公告)号：EP2408008A4

公开(公告)日：2013-04-03

申请号：EP10750657

申请日：2010-02-19

申请人： SUMITOMO BAKELITE CO

发明人： SHIRAISHI FUMIHIRO ,  KAWATA MASAKAZU ,  YONEYAMA MASAHIRO ,  TAKAHASHI TOYOSEI ,  DEJIMA HIROHISA ,  SATO TOSHIHIRO

IPC分类号： H01L23/10 ,  C09J7/02 ,  G03F7/09 ,  H01L27/146

CPC分类号： H01L27/14618 ,  C09J7/20 ,  H01L27/14627 ,  H01L27/14685 ,  H01L2924/0002 ,  Y10T428/24752 ,  H01L2924/00

摘要： A spacer formation film is adapted to be used for forming a spacer defining air-gap portions on a side of one surface of a semiconductor wafer and by being cut into a desired shape, the spacer formation film includes: a support base having a sheet-like shape; a spacer formation layer provided on the support base and having a bonding property, the spacer formation layer formed of a material containing an alkali soluble resin, a thermosetting resin and a photo polymerization initiator; and a cutting line along which the spacer formation film is to be cut, wherein the spacer formation layer is provided inside the cutting line so that a peripheral edge thereof is not overlapped to the cutting line.

公开(公告)号：EP2154205A4

公开(公告)日：2011-01-05

申请号：EP08764553

申请日：2008-05-23

申请人： SUMITOMO BAKELITE CO

发明人： TAKAHASHI TOYOSEI ,  TAKAYAMA RIE

IPC分类号： C08L101/00 ,  C08J5/18 ,  C08K3/00 ,  G03F7/004 ,  G03F7/027 ,  G03F7/032 ,  G03F7/038 ,  H01L23/02

CPC分类号： G03F7/0047 ,  G03F7/032 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2400541A4

公开(公告)日：2013-03-27

申请号：EP10743719

申请日：2010-02-15

申请人： SUMITOMO BAKELITE CO

发明人： DEJIMA HIROHISA ,  KAWATA MASAKAZU ,  YONEYAMA MASAHIRO ,  TAKAHASHI TOYOSEI ,  SHIRAISHI FUMIHIRO ,  SATO TOSHIHIRO

IPC分类号： H01L23/02 ,  H01L23/10 ,  H01L23/29 ,  H01L23/31 ,  H01L27/14

CPC分类号： H01L23/315 ,  H01L23/293 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1252966A4

公开(公告)日：2004-11-03

申请号：EP00987764

申请日：2000-12-27

申请人： SUMITOMO BAKELITE CO

发明人： HOSOMI TAKESHI ,  OKADA RYOUICHI ,  NAKAMURA KENSUKE ,  TAKAHASHI TOYOSEI

IPC分类号： B23K35/22 ,  B23K35/36 ,  H01L21/56 ,  H01L21/60 ,  H05K3/28 ,  H05K3/34 ,  B23K35/363

CPC分类号： H01L24/81 ,  B23K35/224 ,  B23K35/3612 ,  B23K35/3613 ,  H01L21/563 ,  H01L2224/13111 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/284 ,  H05K3/3489 ,  H01L2224/0401

摘要： A hardening flux acting as a flux during soldering and, when hardened by heating, acting as a reinforcing material for the soldered joint; a soldering resist; a semiconductor package wherein the hardening flux is applied to the circuit exposed surface, solder balls are joined and the solder ball joint is reinforced by the flux which is hardened by heating; a semiconductor device wherein said hardening flux is applied to a semiconductor mounting board having a soldering land and is soldered, and wherein the flux, which is hardened by heating, reinforces the solder joint; and a method of producing said package and said device. A hardening flux which acts as a flux in soldering a semiconductor package to a semiconductor mounting board and which, after soldering, is hardened by further heating to serve as a reinforcing agent for the solder joint; a soldering resist; a semiconductor package reinforced by the hardening flux; a semiconductor device; and a method of producing said semiconductor package and semiconductor device.

公开(公告)号：EP2273314A4

公开(公告)日：2011-05-25

申请号：EP09722561

申请日：2009-03-16

申请人： SUMITOMO BAKELITE CO

发明人： SHIRAISHI FUMIHIRO ,  TAKAHASHI TOYOSEI

IPC分类号： G03F7/004 ,  G03F7/038 ,  H01L21/027

CPC分类号： G03F7/0047 ,  G03F7/038 ,  Y10T428/25

公开(公告)号：EP1990389A4

公开(公告)日：2010-05-26

申请号：EP06714737

申请日：2006-02-27

申请人： SUMITOMO BAKELITE CO

发明人： TAKAHASHI TOYOSEI

IPC分类号： C09J7/02 ,  H01L23/10

CPC分类号： H01L23/10 ,  C09J7/10 ,  C09J2205/102 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  Y10T428/1059 ,  Y10T428/1073 ,  H01L2924/00 ,  H01L2924/3512

摘要： An adhesive film used for bonding a semiconductor component or a liquid crystal display component with a substrate, the adhesive film being composed of a resin composition containing a curable resin and a filler, and the adhesive film showing a water vapor transmission rate of 30 [g/m 2 ·24h] or above, wherein the curable resin preferably contains photo-curable resin, thermosetting resin, or curable resin cured both by light and heat. The filler preferably contains a porous filler, the filler preferably has a mean void diameter of 0.1 to 5 nm, and the adhesive film preferably shows a water vapor transmission rate at 25°C of 4 [g/m 2 ·24h] or above.

公开(公告)号：EP2400542A4

公开(公告)日：2013-03-27

申请号：EP10743718

申请日：2010-02-15

申请人： SUMITOMO BAKELITE CO

发明人： SATO TOSHIHIRO ,  KAWATA MASAKAZU ,  YONEYAMA MASAHIRO ,  TAKAHASHI TOYOSEI ,  DEJIMA HIROHISA ,  SHIRAISHI FUMIHIRO

IPC分类号： H01L23/10 ,  H01L23/02 ,  H01L27/146 ,  H01L31/0203

CPC分类号： H01L27/14683 ,  H01L23/3114 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP2169723A4

公开(公告)日：2013-03-13

申请号：EP08710414

申请日：2008-02-19

申请人： SUMITOMO BAKELITE CO

发明人： TAKAHASHI TOYOSEI ,  TAKAYAMA RIE ,  SUGINO MITSUO ,  KAWATA MASAKAZU

IPC分类号： H01L31/0203 ,  H01L23/02 ,  H01L23/10 ,  H01L27/14 ,  H01L27/146 ,  H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light receiving device 1 includes a support substrate 12 provided thereon with a photodetector 11 including a photodetecting portion 111 and a base substrate 112 on which the photodetecting portion 111 is placed; and a transparent substrate 13 disposed so as to oppose the face of the support substrate 12 on which the photodetector 11 is provided. Between the support substrate 12 and the transparent substrate 13, a frame portion 14 is provided so as to surround the photodetector 11. The frame portion 14 is a photo-curing adhesive, and directly adhered to the transparent substrate 13 and the support substrate 12. Such structure provides a light receiving device capable of exhibiting the desired performance, and a method of manufacturing such light receiving device can also be provided.

公开(公告)号：EP2166036A4

公开(公告)日：2011-10-19

申请号：EP08765484

申请日：2008-06-11

申请人： SUMITOMO BAKELITE CO

发明人： TAKAHASHI TOYOSEI ,  TAKAYAMA RIE ,  DEJIMA HIROHISA ,  KUSUNOKI JUNYA

IPC分类号： C08L61/14 ,  C08F2/44 ,  C08G8/30 ,  C08L63/00 ,  H01L21/768 ,  H01L23/14 ,  H01L23/48 ,  H01L23/52

CPC分类号： C08L63/10 ,  H01L21/76898 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  Y10T428/24273 ,  H01L2924/014