发明公开
- 专利标题： Plating method
- 专利标题（中）： Plattierungsverfahren
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申请号： EP02253442.4申请日： 2002-05-15
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公开(公告)号： EP1260607A3公开(公告)日： 2004-04-21
- 发明人: Rzeznik, Maria Anna , Jacques, David L.
- 申请人： Shipley Company LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Shipley Company LLC
- 当前专利权人： Shipley Company LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Kent, Venetia Katherine
- 优先权： US293662P 20010525
- 主分类号： C23C18/18
- IPC分类号： C23C18/18 ; C23C18/42 ; H05K3/24
摘要：
The present invention discloses compositions for increasing the adhesion of a layer of silver deposited from an immersion plating bath as well as methods of increasing the adhesion of silver layers obtained using these compositions. Such compositions and methods are particularly useful in the manufacture of electronic devices.
公开/授权文献
- EP1260607A2 Plating method 公开/授权日：2002-11-27
信息查询
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